Service-Manual-AplioXG

[Page 1] SERVICE MANUAL FOR DIAGNOSTIC ULTRASOUND SYSTEM MODEL SSA-790A (2D730-512EN) © TOSHIBA MEDICAL SYSTEMS CORPORATION 2006 ALL RIGHTS RESERVED

[Page 2] IMPORTANT! 1. No part of this manual may be copied or reprinted, in whole or in part, without written permission. 2. The contents of this manual are subject to change without prior notice and without our legal obligation.

[Page 3] REVISION RECORD REV. DATE REASON PAGE SER. DOC. (MM/YY) No. PRODUCT. /AUTHOR CHANGED INI. 08/'06 Mr. Nakai ------- KD-WPX

[Page 4] Safety Precautions 1. Meaning of Signal Words In this manual, the signal words DANGER , WARNING , and CAUTION are used regarding safety and other important instructions. The signal words and their meanings are defined as follows. Please understand their meanings clearly before reading this manual. Signal word Meaning Indicates an imminently hazardous situation which, if not avoided, will DANGER result in death or serious injury. Indicates a potentially hazardous situation which, if not avoided, could WARNING result in death or serious injury. Indicates a potentially hazardous situation which, if not avoided, may CAUTION result in minor or moderate injury. CAUTION Indicates a potentially hazardous situation which, if not avoided, may result in property damage. 2. Meaning of Safety Symbols Symbol Description Type-B applied part * Type B when Type-B applied part is connected. The PCG sensor and pulse sensor that can be connected to this system are Type-B applied parts. Type-BF applied part * Type BF when Type-BF applied part is connected. All ultrasound transducers, ECG cables, and respiration sensors that can be connected to this system are Type-BF applied parts. "Attention" (Refer to the operation manual.)

[Page 5] 3. Safety Precautions Please observe the following precautions to ensure the safety of service engineers as well as operators when using this system. DANGER: Do not use flammable gases such as anesthetics, or flammable liquids such as ethanol, near this product, because there is danger of explosion. WARNING: 1. Information concerning the terminal to which the potential equalization conductor is to be connected ( ): To use another medical device in combination with this system, an equipotential wire for connecting to an equipotential bus must be supplied. For more information, contact your TOSHIBA representative. * Be sure to connect the potential-equalization lead wire before inserting the equipment power plug into the receptacle. Also, be sure to remove the equipment power plug from the receptacle before disconnecting the wire to avoid electrical shock. 2. Information concerning the functional earth terminal ( ): Use of the functional earth terminal as protective earth is not allowed in Europe. The system should be connected according to local requirements. 3. Do not connect this system to outlets with the same circuit breakers and fuses that control current to devices such as life-support systems. If this system malfunctions and generates an overcurrent, or when there is an instantaneous current at power ON, the circuit breakers and fuses of the building’s supply circuit may be tripped. 4. Do not connect to the system transducers other than those specified by TOSHIBA, to prevent accidents such as fire. 5. Do not subject the transducers to knocks. Use of defective transducers may cause an electric shock. CAUTION: 1. Malfunctions due to radio waves (1) Use of radio-wave-emitting devices in the proximity of this kind of medical electronic system may interfere with its operation. Do not bring or use devices which generate radio waves, such as cellular telephones, transceivers, and radio controlled toys, in the room where the system is installed. (2) If a user brings a device which generates radio waves near the system, they must be instructed to immediately turn OFF the device. This is necessary to ensure the proper operation of the system.

[Page 6] CAUTION: 2. Be sure to install the system on a level floor and lock the casters. If this is not done, the system may move, injuring the service personnel. 3. Confirm that movable sections such as the LCD monitor and operating panel are locked before moving the system. Otherwise, the movable sections may move unexpectedly and cause injury. 4. Move the system forward or backward only. If the system is moved to the left or right, it may fall, causing injury. In addition, be sure to fix the moving sections such as the operating panel before moving the system. If such sections move, they may catch the hands or fingers of the persons moving the system, possibly causing injury. 5. To prevent electric shock, do not connect the peripheral units (video printer, VCR, etc.) to an external outlet. Peripheral units should be connected to the service outlet of the system or the optional isolation transformer. For the connection procedures, contact your TOSHIBA representative. 6. The service outlet of the main unit is intended solely for recommended peripheral units. Do not connect devices other than recommended peripheral units to the service outlet. Connecting devices other than those recommended may cause the consumption current to exceed the power capacity of the main unit, possibly resulting in malfunction. 7. Do not place any objects on top of the monitor. They may fall, causing injury. 8. Do not allow fluids such as water to contact the system or peripheral devices. Electric shock may result. 9. Do not handle the system with wet or moist hands. Electric shock may result. 10. Be sure to turn OFF the power breaker and disconnect the mains plug from the outlet before removing the covers of the main unit and performing internal wiring. 11. When discarding any part of this system, follow all applicable local regulations. 12. Wear protective gloves to ensure safety and prevent infection when performing unit replacement, board replacement, internal wiring, or cleaning. 13. Wait at least 30 seconds after turning OFF the power breaker and disconnecting the mains plug from the outlet before replacing the battery. Otherwise, an electric shock may result.

[Page 7] CAUTION: Voltage setting after the power supply unit has been replaced The power supply unit is provided with switches for selecting the output voltage according to the input voltage. If the switch settings are incorrect, the system power is not turned ON normally or peripheral units may be damaged. Be sure to check the settings of the voltage selection switches after the power supply unit has been replaced. 100 to 115 VAC 115 115 "115" must be displayed on S1 and S2. S1 S2 230 VAC 230 230 "230" must be displayed on S1 and S2. S1 S2

[Page 8] CONTENTS Safety Precautions------------------------------------------------------------------------------------------------------------------ 4 1. INTRODUCTION ---------------------------------------------------------------------------------------------------------- 12 1.1 Outline --------------------------------------------------------------------------------------------------------------- 12 1.2 PWB Configuration of Each Unit------------------------------------------------------------------------------ 12 2. GENERAL BLOCK DIAGRAM ----------------------------------------------------------------------------------------- 13 3. DISASSEMBLY AND REMOVAL PROCEDURES --------------------------------------------------------------- 14 3.1 Name of Each Section------------------------------------------------------------------------------------------- 14 3.2 Removing the Handle-------------------------------------------------------------------------------------------- 15 3.3 Removing the Monitor Unit------------------------------------------------------------------------------------- 16 3.3.1 Removing the monitor unit------------------------------------------------------------------------- 16 3.3.2 Removing the LCD monitor arm ----------------------------------------------------------------- 17 3.3.3 Adjusting the LCD monitor arm vertical movement resistance -------------------------- 20 3.4 Removing the Operating Panel ------------------------------------------------------------------------------- 21 3.5 Disassembling the Operating Panel ------------------------------------------------------------------------- 26 3.5.1 Removing the lower cover ------------------------------------------------------------------------- 26 3.5.2 Removing the upper cover ------------------------------------------------------------------------ 28 3.5.3 Removing the keyboard ---------------------------------------------------------------------------- 30 3.5.4 Removing the full keyboard ----------------------------------------------------------------------- 32 3.5.5 Removing the palm controller -------------------------------------------------------------------- 33 3.5.6 Removing the lower-cover PWBs and keytops ---------------------------------------------- 34 3.5.7 Removing the upper-cover PWBs and keytops---------------------------------------------- 36 3.5.8 Removing the LED PWB--------------------------------------------------------------------------- 38 3.5.9 Removing the near/away slide lever ------------------------------------------------------------ 39 3.5.10 Removing the up/down slide lever -------------------------------------------------------------- 41 3.6 Removing the PSA and PSD ---------------------------------------------------------------------------------- 42 3.7 Removing the PWB Rack -------------------------------------------------------------------------------------- 44 3.8 Removing the PWBs--------------------------------------------------------------------------------------------- 46 3.9 Removing the TI -------------------------------------------------------------------------------------------------- 47

[Page 9] 3.10 Removing the IO -------------------------------------------------------------------------------------------------- 48 3.11 Removing the HDD Unit ---------------------------------------------------------------------------------------- 49 3.12 Removing the Battery-------------------------------------------------------------------------------------------- 50 3.13 Removing the Transformer------------------------------------------------------------------------------------- 51 3.14 Removing the Rear Panel -------------------------------------------------------------------------------------- 53 3.15 Removing the PHYSIO Unit ----------------------------------------------------------------------------------- 55 3.16 Removing the Caster Units ------------------------------------------------------------------------------------ 56 3.17 Cleaning the Air Filters ------------------------------------------------------------------------------------------ 59 3.18 Cleaning the Panel ----------------------------------------------------------------------------------------------- 60 3.18.1 Cleaning of keytops --------------------------------------------------------------------------------- 60 3.18.2 Cleaning procedures for parts other than keytops ------------------------------------------ 60 3.19 Adjusting the Operating Panel Locking Wire -------------------------------------------------------------- 61 3.19.1 Adjusting the up/down slide wire----------------------------------------------------------------- 61 3.19.2 Adjusting the near/away slide wire -------------------------------------------------------------- 62 3.20 Replacing the Operating Panel Locking Wire ------------------------------------------------------------- 63 3.20.1 Replacing the up/down slide wire---------------------------------------------------------------- 63 3.20.2 Replacing the near/away slide wire ------------------------------------------------------------- 68 3.21 Removing the DVD Drive Unit--------------------------------------------------------------------------------- 73 4. FUNCTIONS OF EACH PWB ------------------------------------------------------------------------------------------ 75 4.1 Front-End Unit ----------------------------------------------------------------------------------------------------- 75 4.1.1 TI --------------------------------------------------------------------------------------------------------- 79 4.1.2 TX -------------------------------------------------------------------------------------------------------- 82 4.1.3 RX board ----------------------------------------------------------------------------------------------- 85 4.1.4 RC board ----------------------------------------------------------------------------------------------- 87 4.1.5 CB board ----------------------------------------------------------------------------------------------- 90 4.1.6 MC board----------------------------------------------------------------------------------------------- 96 4.2 BE Unit -------------------------------------------------------------------------------------------------------------- 99 4.2.1 CPU assembly ---------------------------------------------------------------------------------------100

[Page 10] 4.2.2 BE board ----------------------------------------------------------------------------------------------102 4.2.3 VP (Video Processor)------------------------------------------------------------------------------115 4.2.4 IQDAS (IP)--------------------------------------------------------------------------------------------119 4.3 System-Related Boards----------------------------------------------------------------------------------------123 4.3.1 I/O -------------------------------------------------------------------------------------------------------123 5. OPERATING PANEL ----------------------------------------------------------------------------------------------------125 6. POWER SUPPLY UNIT-------------------------------------------------------------------------------------------------132 6.1 Power Supply Unit Configuration ----------------------------------------------------------------------------132 6.2 Block Diagram of the Power Supply Unit------------------------------------------------------------------133 6.3 Unit Specifications-----------------------------------------------------------------------------------------------134 6.4 Outlines of the Modules ----------------------------------------------------------------------------------------135 6.4.1 TRANS-UNIT-----------------------------------------------------------------------------------------135 6.4.2 Battery -------------------------------------------------------------------------------------------------136 6.4.3 PSA-S--------------------------------------------------------------------------------------------------137 6.4.4 PSD-S--------------------------------------------------------------------------------------------------137 6.5 Description of Each Connector-------------------------------------------------------------------------------138 6.6 Operational Checks ---------------------------------------------------------------------------------------------140 6.7 LEDs for Error Display------------------------------------------------------------------------------------------141 7. LCD MONITOR -----------------------------------------------------------------------------------------------------------142 8. PHYSIO MODULE -------------------------------------------------------------------------------------------------------147 9. CONNECTION DRAWING FOR UNITS----------------------------------------------------------------------------149 10. SOFTWARE ORGANIZATION----------------------------------------------------------------------------------------151 10.1 Overall Folder Configuration----------------------------------------------------------------------------------151 10.2 Version Information ---------------------------------------------------------------------------------------------152 10.3 Error Handling ----------------------------------------------------------------------------------------------------153 10.3.1 Error log operation----------------------------------------------------------------------------------153 10.3.2 Error messages--------------------------------------------------------------------------------------154 10.3.3 Error levels (severity) ------------------------------------------------------------------------------154

[Page 11] 10.3.4 Error log operation (facility)-----------------------------------------------------------------------155 11. SETTING THE PRESET MENU --------------------------------------------------------------------------------------156 11.1 Outline of Each Preset -----------------------------------------------------------------------------------------156 11.2 Setting and Changing Presets -------------------------------------------------------------------------------160 11.3 Preset Editors-----------------------------------------------------------------------------------------------------165 11.4 Description of Preset Parameters ---------------------------------------------------------------------------169 12. BACKING UP THE USERS DATA -----------------------------------------------------------------------------------213 12.1 Backing Up the Preset Data ----------------------------------------------------------------------------------213 12.1.1 Backup-------------------------------------------------------------------------------------------------213 12.1.2 Restoration -------------------------------------------------------------------------------------------213 12.2 Backing Up the Image Data-----------------------------------------------------------------------------------213 12.2.1 Backup-------------------------------------------------------------------------------------------------213 12.2.2 Restoration -------------------------------------------------------------------------------------------213 13. NETWORK CONNECTION --------------------------------------------------------------------------------------------214 13.1 Changing the PC Name----------------------------------------------------------------------------------------214 14. DATE/TIME SETTING CHANGE-------------------------------------------------------------------------------------217 14.1 To Change the System Time Only --------------------------------------------------------------------------217 14.2 To Change the System Date and Time --------------------------------------------------------------------217

[Page 12] 1. INTRODUCTION 1.1 Outline This system produces high-quality images in 2D, M, FFT Doppler, and Color Doppler modes. The system is classified into the following seven units. (1) Front-end unit (includes some options) (2) Back-end unit (3) System-related units (includes some options) (4) Power supply unit (5) Monitor (6) Operating panel (7) Physio unit (option) 1.2 PWB Configuration of Each Unit Table 1-1 PWB configuration of each unit of the AplioXG Unit PWB name Drawing No. YW No. Remarks Front-end unit TI PM30-35061 YWP4811 TX PM30-32732 YWP4662 RX PM30-32733 YWP4763 RC PM30-35065 YWP4815 CB PM30-32747 YWP4667 Option MC PM30-32736 YWP4666 Option Back-end unit BE PM30-35071 YWP4821 IQDAS PM30-35073 YWP4823 VP PM30-32742 YWP4672 Option CPU-ASSY PM30-35627 ― When a part of the CPU-ASSY is to be replaced, the whole CPU-ASSY should be replaced as a single unit. MA PM30-32744 YWP4774 PB PM30-32748 YWP4677 ATX PM30-35628 ― AGP PM30-32829 ― System related unit BP PM30-30381 YWP4780 IO PM30-32746 YWP4676 UP PM30-33667 YWP4777

[Page 13] MOD Panel Keyboard DICOM: Printer PC etc. VCR S-VHS DVD Recorder (NTSC/PAL) B&W PRINTER COLOR PRINTER MONITOR 19" SVGA (800*600) DVD-VSR USB HUB TCS Foot SW USB Memory IASSIST Ethernet Card Reader Front Panel Barcode Reader Speaker*2 C-Video DVD HDD 1 S-Video Amp. IO USB HUB RGB DVI PS/2 Audio RS232-1 RS232-2 USB-4 USB-1 USB-2 On/Off USB-0 USB-6 USB-5 USB-3 EIDE-P EIDE-S SATA1 SATA2 NTSC =3 PAL RGB Audio MIC Audio L+R (in, out) ResetSW 10/100TX (SBC) Video Buffer Display Mixer Graphic AGP FDD Power Control 5V-DC-IN RM cPCI Pentium4 3 GHz (TBD) Memory 2 GB PB MA PCI-BUS 32 SC PCI Bridge Software (Option) Software Software IQDAS EP FP DSP (SIP) '5 '5 '5 DR Frame BE (Back End) BP (Back Plane) FE Bus Mixer Filter RXBF RTC Pencil TX,Rx Clock Gen CB (CW BFI) ABF (Receiver & Controller) RC FAN PSD (Digital DC) PSA (Analog DC) PSH (Analog DC) AC-OUT1: Monitor AC-OUT2: B&W Printer AC-OUT3: Color Printer AC-OUT4: Video Unit AC-OUT5: IASSIST AR System FAN Power Control Batteries (Nickel metal hydride) 4.8 V TBDmAh TXPG MC (Motor Controller) RX1 Matrix Switch Pulser1:VTX1 Pulser2:VTX2 TX (96CH) TX (96CH) Tx Bus Transformer Tray 100/230 V (selectable) Relay Matrix Physio TI (Transducer IF) 220-240 V 100-120 V ECG (DC-IN) Resp. PCG Pulse AUX GENERAL BLOCK DIAGRAM Probe 2.

[Page 14] 3. DISASSEMBLY AND REMOVAL PROCEDURES 3.1 Name of Each Section Transducer cable arm Monitor Operating panel Keyboard Rear panel

[Page 15] 3.2 Removing the Handle (1) Removing the handle (a) Remove the caps <A> and <B> set in the handle and the rear cover. (b) Remove (or loosen) the two M6 bolts <A>. (c) Remove the two M6 bolts <B> to remove the handle. Bolt <B> (6B6-16SDM) Handle Rear cover Bolt <A> (6B6-16SDM)

[Page 16] 3.3 Removing the Monitor Unit CAUTION: Two persons are required when removing the monitor unit. If a worker removes the monitor alone, he/she may be injured. 3.3.1 Removing the monitor unit (1) Remove the screw <A> and then remove the connector cover. (2) Remove the M4 screw <B> and clamp to disconnect the power cable. (3) Disconnect the DVI cable. (4) Attach the connector cover and secure it with the screw <A>. * The screw <A> is a self-tapping screw. Special care is required when tightening it. (5) Remove the two M4 screws <C>. (6) Loosen the two M4 screws <D> and then remove the LCD monitor from the arm. LCD monitor Clamp (SBPP4-16SCR) DVI cable Power cable LCD monitor arm

[Page 17] 3.3.2 Removing the LCD monitor arm (1) Remove the two caps and the two M3 screws <A> to remove arm cover 1. (2) Remove the two M3 screws <B> to remove arm cover 2. (3) Remove the two M3 screws <C> to remove arm base cover 1. (4) Raise the stopper and remove the M3 screw <D> and the M3 screw <E>. Cap Screw <A> (SBPP3-6SCR) Arm cover 1 (PS3-8SCR) Arm cover 2 (PS3-8SCR) Arm base cover 1 Stopper Screw <E> (SBPP3-8SCR) (PS3-8SCR)

[Page 18] (5) Rotate the arm biaxial rotation column in the direction indicated by the arrow in the figure below. Lift arm base cover 2 to separate it from the stopper. Arm base cover 2 Biaxial rotation column Stopper (6) Remove the two M3 screws <F> and the clamps <G> and <H>. (7) Remove the three M4 screws <I> and the clamps <J>, <K>, and <L>. Screw <F> (SBPP3-8SCR) Clamp <G> Clamp <H> Screw <I> Clamp <K> Base Clamp <J> Clamp <L> (8) Remove the cables one by one from the LCD monitor arm to the base.

[Page 19] (9) Push in the neck of the support rear cover to disengage it from the support front cover and remove it. (10) Remove the two M4 screws <A> to remove the support front cover. (11) Remove the four M6 bolts <B> to remove the LCD monitor arm. (12) Lift the LCD monitor arm and remove the two monitor cables from the arm. LCD monitor arm Support front cover Bolt <B> (6B6-16SDM) Operating panel Support rear cover

[Page 20] 3.3.3 Adjusting the LCD monitor arm vertical movement resistance (1) Remove the two caps and the two M3 screws <A> to remove arm cover 1. (2) Remove the two M3 screws <B> to remove arm cover 2. Arm cover1 Cap (SBPP3-6SCR) (PS3-8SCR) Arm cover 2 (3) Using the M6 hex key, rotate the hexagonal socket head bolt to adjust the vertical movement resistance of the LCD monitor arm. Reducing the LCD monitor vertical Increasing the LCD monitor movement resistance vertical movement resistance Hexagonal socket head bolt

[Page 21] 3.4 Removing the Operating Panel The operating panel must be raised using the up/down slide lever in advance. (1) Removing the handle Refer to subsection 3.2. (2) Removing the monitor unit Refer to subsection 3.3.1. (3) Removing the LCD monitor arm Refer to subsection 3.3.2. (4) Removing the right side cover (5) Removing the left side cover (6) Removing the right side cover for the peripheral units Remove the two M4 screws <C> to remove the cover. * The cover can be removed by lifting it and pulling it toward you. (7) Removing the left side cover for the peripheral units Remove the two M4 screws <D> to remove the cover. * The cover can be removed by lifting it and pulling it toward you. (8) Removing the top cover (a) Remove the four caps. (b) Remove the four M4 screws <E> to remove the cover.

[Page 22] Left side cover for Top cover the peripheral units Cap (SBPP4-12SCR) Screw <E> Left side cover Right side cover for the peripheral units Cap Cap

[Page 23] (9) Removing the bellows Remove the two M4 screws <F>. (10) Removing the front/rear sliding wire (a) Remove the M3 screw <G> to remove the retaining clamp for the front/rear sliding wire. (b) Loosen the screw <H> and rotate the wire retaining bracket to remove the end of the wire. (c) Rotate the wire to remove it from the up/down mechanism. Front/rear sliding wire Bellows Screw <F> Screw <H> Screw <G> (SBPP3-10SCR) Front/rear sliding wire Clamp Wire retaining bracket

[Page 24] (11) Removing the up/down sliding wire (a) Remove the end of the wire from the lever. (b) Rotate the wire to remove it from the up/down mechanism. Up/down slide lever Up/down sliding wire (12) Removing the cables Remove the connected cables and the two M3 screws <I> to remove the clamp. Screw <I> (SBPP3-8SCR) Clamp

[Page 25] (13) Remove the operating panel from the system (a) Remove the four M6 bolts <J>. (b) Loosen the two M6 bolts <K>. Rotate the operating panel clockwise and lift it to remove it. Bolt <J> (6B6-16SDM) Bolt <K> (6B6-16SDM) Bracket

[Page 26] 3.5 Disassembling the Operating Panel 3.5.1 Removing the lower cover Lower cover Paddle switch (1) Remove the two screws <A> on the back of the panel. Screw <A> Screw <A> (2) To remove the lower cover, lift it by pulling the paddle switches toward you.

[Page 27] (3) Disconnect the two cables from the lower cover. Cable connectors

[Page 28] 3.5.2 Removing the upper cover Upper cover (1) Remove the two screws <A> from the top part of the back of the upper cover. Screws <A>

[Page 29] (2) Pull out the upper cover to remove it. Pull out (3) Disconnect the two cables from the upper cover. Cable connectors

[Page 30] 3.5.3 Removing the keyboard (1) Pull out the keyboard. Keyboard Pull out Pull out (2) Disconnect the cable from the bottom of the keyboard. Cable (3) Remove the eight screws indicated by stars in the figure below from the bottom of the keyboard.

[Page 31] (4) Pull the keyboard in the direction indicated by the arrow in the figure below to remove it from the operating panel. Pull out

[Page 32] 3.5.4 Removing the full keyboard (1) Remove the eight screws indicated in the figure below from the bottom of the full keyboard. (2) Remove the top cover. (3) Remove the two FPCs from the PWB. (4) Remove the full keyboard from the bottom cover. Top cover Full keyboard FPC PWB Bottom cover

[Page 33] 3.5.5 Removing the palm controller Disconnect the connector from the palm controller and remove the palm controller from the lower cover. Lower cover Palm controller Connector

[Page 34] 3.5.6 Removing the lower-cover PWBs and keytops (1) Remove the encoder knobs (A: 1, B: 2, C: 11) and the four mode-switch knobs from the lower cover. Mode-switch knob (4) Encoder knob C (1) Encoder knob B (2) Encoder knob A (1) (2) Remove the 12 screws <A> to remove PWB1. (3) Remove the 15 screws <B> to remove PWB2. (4) Remove the four screws <C> to remove the wheel switch. * The wheel switch contains a spring and caution is required when removing it. * When reinstalling the wheel switch, be sure to insert the wheel switch pin securely in the opening in the metal plate guide. If the pin is not inserted securely, the operating panel will not operate normally. Press the wheel switch to confirm its operation. (5) Remove the rubber sheet. Wheel switch pin Wheel switch PWB 1 Opening in the metal plate guide PWB 2 Screw <C> Rubber sheet Screw <B>

[Page 35] (6) Remove the keytops and paddle switches. Paddle switch

[Page 36] 3.5.7 Removing the upper-cover PWBs and keytops (1) Remove the encoder knobs (A: 1, B: 1, C: 9) from the lower cover. Encoder knob C (9) Encoder knob A (1) Encoder knob B (1) (2) Remove the nine screws <A> and remove the PWB (A). (3) The rubber sheet must be removed before the keytops can be removed. (4) Remove the three screws <B> and remove the bracket A and the PWB (B). Bracket <A> PWB <B> PWB <A> Rubber sheet

[Page 37] (5) Remove the nine screws <C> and remove the PWB (C). (6) Remove the two screws <D> and remove the PWB (D). (7) The rubber sheet must be removed before the keytops can be removed. (8) Remove the five screws <E> and remove the PWB (E). (9) Remove the two screws <F> and remove the bracket B. (10) Remove the two screws <G> and remove the PWB (F). (11) Remove the screw <H> and remove the bracket C and the PWB (G). (12) Remove the three screws <I> and remove the PWB (H). Rubber sheet PWB <F> PWB (H) Screw <I> Screw <G> Bracket C and PWB <G> PWB <F> Screw <G> Bracket B Screw <F> Screw <H> PWB (E) PWB <C> Screw <E> Screw <C> (13) Remove the ten screws <J> and remove the bracket D. (14) Remove the four screws <K> and remove the TCS. Screw <K> TCS Bracket D Screw <J>

[Page 38] 3.5.8 Removing the LED PWB * The lower cover must have already been removed by referring to subsection 3.5.1. (1) Disengage the two tabs at the top part of the LED PWB and remove the LED PWB from the operating panel. Tabs (two) LED PWB

[Page 39] 3.5.9 Removing the near/away slide lever * The lower cover and upper cover must have already been removed by referring to subsections 3.5.1 and 3.5.2. (1) Remove the 22 screws marked with  from the back of the operating panel. (2) Remove the jelly holders (two) and transducer holders (six). (3) Remove the screw <A> and remove the handle. Jelly holders (two) holders (six) Handle

[Page 40] (4) Remove the screw <B> and remove the clamp. (5) Remove the screw <C> and remove the bracket and lever. (6) Loosen the nut and adjuster to remove the wire. Nut Screw <C> Adjuster Screw <B> Bracket Wire Lever Clamp

[Page 41] 3.5.10 Removing the up/down slide lever * The lower cover and upper cover must have already been removed by referring to subsections 3.5.1 and 3.5.2. (1) Remove the screw <A> and remove the clamp. (2) Remove the spring from the wire retaining bracket. (3) Remove the screw <B> to remove the lever, bracket, and spacers. (4) Loosen the nut and adjuster to remove the wire. Clamp Nut Wire Spacer Wire retaining bracket Spring Bracket Lever Spacer

[Page 42] 3.6 Removing the PSA and PSD (2) Removing the shield plate Remove the three M3 screws <B> and three M4 screws <C> to remove the shield plate. (3) Removing the PSA FAN Remove the two M4 screws <D> to remove the PSA FAN. (4) Removing the PSA (a) Remove the top screw (for GND) and two bottom screws from among the five screws <E>. (b) Loosen the remaining two screws and then remove the PSA. * The PSA can be removed by lifting it slightly and pulling it toward you. (5) Removing the PSD Remove the two bottom screws from among the four screws <F>. Then loosen the two top screws and remove the PSD. * The PSD can be removed by lifting it slightly and pulling it toward you.

[Page 43] PSA fan (SBPP3-8SCR) PSD Left side cover Screw <F> PSA Screw <E> (SBPP3-8SCR) Cap

[Page 44] 3.7 Removing the PWB Rack CAUTION: Two persons are required when removing the PWB rack. Confirm that the transducers have been removed. (1) Removing the PSA and PSD Refer to subsection 3.6. (2) Removing the left side cover (3) Removing the right side cover (b) Remove the two M4 screws <C> to remove the cover. (4) Removing the right side cover for the peripheral units Remove the two M4 screws <D> to remove the cover. * The cover can be removed by lifting it and pulling it toward you. (5) Removing the PWB rack (a) Remove all the cables connected to the PWB rack. (b) Remove the two M4 screws <E> and extract the PWB rack.

[Page 45] Right side cover for the peripheral units PWB rack Screw <E> (PTR4-10SCR) (SBPP4-12SCR)

[Page 46] 3.8 Removing the PWBs (2) Removing the PWBs (a) Loosen the four screws <B> to remove the PWB rack shield plate. (b) Release the card ejectors at the upper and lower ends of the PWB and extract the PWB. PWB PWB rack Card ejectors

[Page 47] 3.9 Removing the TI Confirm that the transducers have been removed. (2) Removing the TI (a) Remove the cable for the pencil transducer (PP) connected to the TI. (b) Loosen the two M4 screws <B> to extract the TI. TI

[Page 48] 3.10 Removing the IO (2) Removing the shield plate Remove the four M4 screws <B> to remove the shield plate. (3) Removing the IO (a) Remove all the cables connected to the IO. (b) Remove the 16 M3 screws <C> to extract the IO. (SBPP3-8SCR) IO Cap

[Page 49] 3.11 Removing the HDD Unit (2) Remove the shield plate Remove the four M4 screws <B> to remove the cover. (3) Removing the HDD unit Remove the two M3 screws <C> to remove the HDD unit. HDD unit (SBPP3-8SCR) (SBPP3-8SCR)

[Page 50] 3.12 Removing the Battery (2) Removing the battery (a) Remove the battery connector that is connected to the transformer. (b) Remove the battery of the shield plate. Transformer Left side cover Battery Cap

[Page 51] 3.13 Removing the Transformer (3) Removing the power supply section rear cover Remove the four M4 screws <C> to remove the cover. (4) Removing the base rear cover Loosen the two M4 screws <D> to remove the cover. * The cover can be removed by pulling it toward you slightly and lifting it obliquely. (5) Removing the transformer (a) Remove all the cables connected to the transformer. (b) Remove the four M4 screws <E> to extract the transformer.

[Page 52] Screw <B> Left side cover Screw <E> Power supply section rear cover Transformer Base rear cover

[Page 53] 3.14 Removing the Rear Panel (3) Removing the power supply section rear cover Remove the four M4 screws <C> to remove the cover. (4) Removing the cables Remove all the cables connected to the rear panel. (5) Removing the rear panel Remove the two M3 screws <D> to remove the rear panel.

[Page 54] Left side cover Power supply Rear panel section rear cover (SBPP3-8SCR) Screw <C> Screw <A> (SBPP4-10SCR) (SBPP4-12SCR)

[Page 55] 3.15 Removing the PHYSIO Unit (2) Removing the right side cover for the peripheral units Remove the two M4 screws <B> to remove the cover. * The cover can be removed by lifting it and pulling it toward you. (3) Removing the PHYSIO unit (a) Remove all the cables connected to the PHYSIO unit. (b) Remove the M4 screw <C> and M4 screw <D> to remove the PHYSIO unit. PHYSIO unit (PTR4-10SCR) Right side cover for the peripheral units Screw <B> Screw <B> (SBPP4-10SCR) (SBPP4-10SCR) Cap

[Page 56] 3.16 Removing the Caster Units (3) Removing the front cover (required to remove the front caster unit) (a) When the blank cover has been mounted, loosen the M3 screw <C> and remove the blank cover with the printer base. (b) Remove the four M4 screws <D> to remove the cover. (4) Removing the power supply section rear cover (required to remove the rear caster unit) Remove the four M4 screws <D> to remove the cover. (5) Removing the base front cover (required to remove the front caster unit) (a) Remove the two M4 screws <F>. (b) Loosen the two M4 screws <G> to remove the cover. * The cover can be removed by pulling it toward you slightly and lifting it obliquely. (6) Removing the base rear cover (required to remove the rear caster unit) Loosen the two M4 screws <H> to remove the cover. * The cover can be removed by pulling it toward you slightly and lifting it obliquely.

[Page 57] Front cover Blank cover Base front cover (SBPP4-10SCR) Screw <F> Screw <G> (SBPP4-12SCR) Left side cover Screw <H> (SBPP4-10SCR) Screw <A> Screw <E> (SBPP4-10SCR) Base rear cover

[Page 58] (7) Removing the blocks Remove the four M4 bolts <I> to remove the two blocks supporting the shaft of the caster unit. (8) Removing the caster units (a) Remove the eight M4 screws <J>. (b) Remove the eight M8 bolts <K> and remove the caster unit by sliding it toward the front of the system. * Remove the caster unit at the rear of the system using the same procedure. Block Bolt <K> (6B8-20SDM) Screw <J> Caster unit Bolt <I> (6B4-16SDM)

[Page 59] 3.17 Cleaning the Air Filters (1) Removing and cleaning the air filters (for service engineers) (a) Remove the two M4 screws to extract both the front and rear filters. (b) Remove the dust from the meshes using a vacuum cleaner. (c) Reinstall the filters by reversing the steps for removal. Air filter Screw Air filter (2) Removing and cleaning the air filters (for the user and service engineers) (a) Remove the filter cover and then remove the air filter. (b) Remove the dust from the mesh using a vacuum cleaner. (c) Reinstall the air filters by reversing the steps for removal. Air filter Filter cover CAUTION: Do not start the system with the filters removed.

[Page 60] 3.18 Cleaning the Panel 3.18.1 Cleaning of keytops (1) Remove dirty keytops by pressing them downward from the surface of the panel. (2) Clean the removed keytops. (3) After cleaning, insert the removed keytops from the back of the panel. CAUTION: Use water or mild detergent to clean the keytops. Completely wipe off the water from the keytops before reinstalling them. Do not use chlorine-based cleansers, acids, or organic solvents (such as alcohol). Also, be sure to reinsert the keytops at their original positions with correct orientations. There is a possibility of reinserting the keytops incorrectly. 3.18.2 Cleaning procedures for parts other than keytops Use a clean dry cloth for cleaning other parts. If dirt is difficult to remove, use a cloth that has been moistened with water or mild detergent and then tightly wrung out. CAUTION: Do not pour water or mild detergent directly on any parts. Do not use volatile organic solvents such as benzin, paint thinner, or alcohol. Also, do not use rags impregnated with chemicals.

[Page 61] 3.19 Adjusting the Operating Panel Locking Wire 3.19.1 Adjusting the up/down slide wire (1) Remove the two caps <A>. (2) Remove the two screws <A> (M4) and remove the right side cover. (SBPP4-12SCR) Cap <A> (3) Loosen the nut. (4) Rotate the adjuster until the lever contacts the gas spring. (5) After adjustment, tighten the nut. Gas spring Loosen the nut. Lever Nut

[Page 62] 3.19.2 Adjusting the near/away slide wire * The lower cover must have already been removed by referring to subsection 3.5.1. (1) Loosen the nut. (2) When the lock cannot be released by using the near/away slide lever, loosen the adjuster. (3) When the lock cannot be engaged by sliding the operating panel away from you, tighten the adjuster. (4) After adjustment, tighten the nut to secure the adjuster. Nut Tighten the adjuster. Loosen the adjuster.

[Page 63] 3.20 Replacing the Operating Panel Locking Wire 3.20.1 Replacing the up/down slide wire (1) Removing the up/down slide wire (at the support unit side) (a) Remove the two caps <A>. (b) Remove the two M4 screws <A> to remove the right side cover. Cap (SBPP4-12SCR)

[Page 64] (c) Loosen the nut. (d) Remove the wire from the lever. (e) Rotate the adjuster and remove it from the bracket. Wire retaining bracket Wire Lever (2) Removing the monitor unit Refer to subsection 3.3.1. (3) Removing the LCD monitor arm Refer to subsection 3.3.2. (4) Perform the procedures in subsections 3.5.1 and 3.5.2 of subsection 3.5 "Disassembling the Operating Panel".

[Page 65] (5) Removing the up/down slide lever Refer to subsection 3.6.11. Clamp Up/down slide lever (6) Replacing the up/down slide wire Install the new up/down slide lever in the operating panel. Insert the tip of the wire into the cable connection hole.

[Page 66] (7) Removing the covers (if wire routing is difficult) (a) Remove the two screws <A> (M4) and remove the right side cover for the peripheral units. (b) Remove the two caps. (c) Remove the two screws <B> (M4) and remove the left side cover. (d) Remove the two screws <C> (M4) and remove the left side cover for the peripheral units. (e) Remove the four screws <D> (M4) and remove the tray. (f) Remove the four screws <E> (M4) and remove the top front cover. Left side cover for the peripheral units Left side cover (SBPP4-10SCR) Right side cover for the peripheral units Cap Top front cover Screw <E> Tray

[Page 67] (8) Connecting the wire (a) Route the wire that is passed through the cable connection hole from the operating panel to the clamp. Connect the wire to the bracket under the support unit and hang it on the lever. (b) For lever adjustment, refer to subsection 3.19.1 "Adjusting the up/down slide wire". (c) Move the operating panel vertically several times by using the up/down slide lever. Confirm that the wire is not forcibly pulled. (d) Install the monitor unit and LCD monitor arm removed in steps (2) and (3). (Cable connection hole) Support unit Up/down slide lever Clamp Lever Wire Bracket (9) Installing the covers Install the covers removed in steps (1) and (7).

[Page 68] 3.20.2 Replacing the near/away slide wire (1) Pull the near/away slide lever of the operating panel toward you to slide the operating panel and the monitor upward. Up/down slide lever Operating panel

[Page 69] (2) Removing the handle (a) Remove the caps <A> and <B>. (b) Remove the four bolts <A> (M4) and remove the handle. Handle Bolt <A> (6B4-16SDM)

[Page 70] (3) Removing the covers (a) Remove the two caps <A>. (b) Remove the two screws <A> (M4) and remove the right side cover. (c) Remove the two screws <B> (M4) and remove the right side cover for the peripheral units. (d) Remove the two caps <B>. (e) Remove the two screws <C> (M4) and remove the left side cover. (f) Remove the two screws <D> (M4) and remove the left side cover for the peripheral units. (g) Remove the four caps <C>. (h) Remove the four screws <E> (M4) and remove the top cover. (i) Remove the four screws <F> (M4) and remove the tray. (j) Remove the four screws <G> (M4) and remove the top front cover. Top cover Cap <C> Left side cover for the peripheral units Screw <E> (SBPP4-12SCR) Left side cover Cap <B> Right side cover for Screw <C> the peripheral units Top front cover Screw <B> Tray Screw <G> Right side (SBPP4-10SCR) cover Screw <F> Cap <A> (SBPP4-10SCR) Screw <A> (4) Perform the procedures in subsection 3.3.1 "Removing the monitor unit" and subsection 3.3.2 "Removing the LCD monitor arm".

[Page 71] (5) Removing the near/away slide wire (at the support unit side) (a) Remove the two screws <A> (M4) and lift the bellows. (b) Remove the screw <B> (M3) and remove the clamp. (c) Loosen the screw <C> and rotate the wire retaining bracket to remove the tip of the wire. (d) Loosen the nut and rotate the adjuster to remove the wire from the support unit. Bellows (SBPP4-12SCR) (SBPP3-10SCR) Wire Clamp Support unit Nut Wire retaining bracket

[Page 72] (6) Perform the procedures in subsections 3.5.1, 3.5.2, 3.5.3, and 3.5.4 and steps (1) and (2) in subsection 3.5.5 of subsection 3.5 "Disassembling the Operating Panel". (7) Removing the near/away slide lever Refer to subsection 3.6.9.

[Page 73] 3.21 Removing the DVD Drive Unit (1) Remove the cap and the two M4 screws <A> and remove the left side cover. (2) Remove the blank cover <A>. (3) Remove the four M3 screws <B> and remove the rack cover. (4) Secure the DVD drive unit in place using the two M3 screws <C>. Rack cover DVD drive unit Left side cover (SBPP3-8SCR) Blank cover <A> (SBPP3-8SCR) Cap

[Page 74] (5) Connect the power cable and the USB cable to the DVD drive unit. NOTE: Command entry Execute the following program after the DVD drive unit is installed or uninstalled. (1) Display the Service menu. (2) Select [Utility] - [Command Line], enter the appropriak command, below and press [Go]. (a) After the DVD is installed D:\Aplio\TusSetupScript\EnableDVD.cmd (b) After the DVD is uninstalled D:\Aplio\TusSetupScript\DisableDVD.cmd (3) Restart the system.

[Page 75] 4. FUNCTIONS OF EACH PWB 4.1 Front-End Unit The front-end unit consists of the Transducer Interface board (TI), the two Transmit boards (TX), the Receive board (RX), the Receive Control board (RC), the Continuous Beamformer board (CB), and the Mechanical 4D Control board (MC). (2) Composition (a) Transducer Interface board (TI) The TI board includes the three electronic scan transducer connectors and a pencil transducer connector. This board enables switching between the transducers. (b) Transmit boards (TX) The two TX boards perform simultaneous transmission for a maximum of 192 channels. In addition, these boards are provided with a transmission delay control function. (c) Receive board (RX) This board performs simultaneous reception for a maximum of 128 channels. It also switches 64 channels to perform reception for 192 elements. In addition, this board is provided with a reception gain control function. (d) Receive Control board (RC) This board performs signal phasing/addition in simultaneous quadrature reception (up to 128 channels). In addition, the Real Time Control circuit (RTC), which controls the front-end unit, is provided. (e) Continuous Beamformer board (CB) This board consists of the signal phasing/addition control circuit, the quadrature detection circuit, and the signal processing circuits for 64 channels for the SCW and dedicated transmission/reception circuits for the ADC and the Pencil CW. (f) Mechanical 4D Control board (MC) This board drives the motor in the Mecha 4D transducer. It makes the piezoelectric element array inside the transducer sweep and transfers the sweep angle information necessary for 3D image creation to the system in real time. (3) Flow of signals in the Front-End unit (a) Transmission system Transmission data from the RTC in the RC board is transferred to the TXPG in the TX board. The transmission delay and transmission waveform data are set. The TXPG has a transmission reference clock (40 MHz, four-phase) and outputs the trigger signals HOUT/LOUT to the PULSER based on the clock. The PULSER outputs a bipolar transmission signal based on the trigger signal. The transmission signal is output to the transducer connector port that is selected on the transducer port selector of the TI board.

[Page 76] (b) Reception system The received echo signals are input through the transducer connector to the TI board and then into the preamplifier in the RX board. The signals are amplified to the predetermined signal level in the preamplifier and input to the RXBF-ASIC in the RC board. The input signals are AD-converted in the RXBF-ASIC and sent for reception beam forming. Beam forming is performed simultaneously in a maximum of four directions and the beams are then output to the BE board. (c) SCW transmission/reception system The SCW transmission system is the same as that described in (a) above. The 64-ch reception signal output from the RX board is input to the CB board that is connected to the RC board in parallel. In the CB board, quadrature detection is performed in the demodulator after reception analog beam forming. Baseband signal processing is then performed and the signals are AD-converted. The I/Q signals that have undergone AD conversion are converted to serial data and are output to the BE board. (d) Pencil CW transmission/reception system The CB board includes the pencil CW transmission/reception circuit. The transmission output signals in the CB board are passed through the pencil transducer connector connected to the TI board using the cable and are then output to the pencil transducer transmission elements. The echo signals received in the pencil transducer are also passed through the TI and are amplified in the pencil CW receiver circuit in the CB board. The signals are then passed through the demodulator or later blocks in the same manner as for the SCW system and are output to the BE board through switch operation. (4) Comparison with the PWBs in Xario Xario AplioXG Major differences TI board 1 TI board 1 A high-voltage circuit has been added to support the 1.5D transducer. TX board 2 TX board 2 None RX board 1 RX board 1 The TI control circuit that is installed on the RX board in Xario has been installed on the TI board. CB board 1 CB board 1 None RC board 1 RC board 1 A control circuit for the 1.5D transducer has been added. MC board 1 MC board 1 None Total 7 PWBs Total 7 PWBs

[Page 77] (5) Testing and calibration of the boards It is necessary to test and calibrate the boards after board replacement. The procedures are outlined below. For details, refer to the service manual (maintenance volume: 2D730-513EN). (a) Testing the boards The functions and performance of the TI, TX, RX, CB, RC, and MC boards should be tested. (b) ADC offset calibration The DC offset of the ADC input of the echo signals should be calibrated. If this calibration is not performed, fixed noise may appear on the image. (c) SCW TX power calibration The errors in the SCW transmission system between the systems should be calibrated. If this calibration is not performed, the transmission voltage during SCW may not be set correctly and excessive acoustic power or insufficient sensitivity may result.

[Page 78] TCIF FPGA USMC FPGA Motor Driver MC Motor Drive Port HV CTRL Address Decoder Block diagram of front-end unit

[Page 79] 4.1.1 TI The TI board (Transducer Interface board) includes the three array transducer connectors and enables switching of the transducers to be connected to the pulser/preamplifier. (2) Description of functions and operation (a) Array transducer switching This board contains the three 360-pin ZIF connectors for the array transducers and switches between the 192-ch echo line and the required control line using a relay. The transmission/reception signals are transferred to the pulser/preamplifier mounted on the TX/RX board through the BackPlane board. (b) Pencil transducer transmission/reception signal connection The connector box for the pencil transducer is installed in the cabinet and is thus connected to the TI board via a cable. The transmission/reception signals coming from the pencil transducer are transferred to the pencil pulser/pencil preamplifier mounted on the CB board through the TI and BackPlane boards. (c) Support of the M-TEE transducer • Thermistor line Transfers signals coming from the temperature detection thermistor embedded in the M-TEE transducer to the ADC mounted on the RC board. (Up to one thermistor is supported.) • Angle detection line Transfers signals coming from the angle detection potentiometer embedded in the M-TEE transducer to the ADC mounted on the RC board. (d) Support of the Mecha 4D transducer The connector box with the Mecha 4D port is installed in the cabinet and is therefore connected to the TI board by a cable. The angle signal and motor drive signal are input at this port. (e) Support of 1.5 D transducer including a HVSW • This board receives the control data for the HVSW embedded in the transducer (walking bus) from the RC board and transfers it to the transducer. • This board supplies ± 100 V for the HVSW embedded in the transducer. (f) Power supply for circuit inside the transducer This board supplies + 5 V for the circuit inside the transducer. An over-current detection circuit is provided.

[Page 80] (g) Error detection The TI board includes detection circuits for the following errors. a. HV fault error This error occurs if the voltage for the HVSW embedded in the transducer is not correct. b. HV detection fault error This error occurs under the following conditions. If this error occurs, the crowbar circuit operates and stops supplying ± 100 V. • The ± 100-V power for the HVSW embedded in the transducer is applied to a connector where no transducer is connected. • The ± 100-V power for the HVSW embedded in the transducer is applied to a connector where a transducer that does not require a high voltage is connected. c. Relay fault error This error occurs if a relay for switching the transducer has values that are different from those of the relay control register. d. Over-current fault error This error occurs if an over-current occurs in the power (+5 V) supplied to the transducer. (h) Transmission disable signal generation The TI board transfers the transmission disable signal (TXDIS) to the TX boards under the following conditions. • An HV fault error is detected (a in (g)) • An HV detection fault error is detected (b in (g)) • A relay fault error is detected (c in (g)) • An over-current fault error is detected (d in (g)) • The HVSW in the 1.5 D transducer is in transition • The transducer selection relay is in transition • The transducer ID of the selected transducer is changed • An empty transducer connector is selected (3) Differences relative to Xario (a) A high-voltage circuit has been added to support the 1.5D transducer. (b) An Address Decoder (FPGA) is included. It is controlled by the TC-BUS.

[Page 81] CW Pencil Transducer Port A Transducer Port B Transducer Port C Stimulus Signal Digital 3 Transmit Control 3 HV MUX Data Sense Relay 3 4 4 Digital I/O Relay 12 4 2 2 2 IIC Signals Relay 6 15 15 Transducer ID ESD & 45 15 Filtering +2.5 V Ref. 4 4 +5 V, +/-100 V Relay 12 4 6 6 Walking Bus Digital 18 6 Position 3 3 Encoder Relay 9 3 6 6 Motor Control Relay 18 6 2 2 Analog Control Buffer & 6 2 Relay Switch Thermistor & Resistive 3 3 Position Sensor Relay 9 3 192 192 CW RX +/- 2 CW TX +/- 2 Transducer ID 7 ESD & 7 Filtering Relay Bank 1 RF TX/RX 192 Relay Bank 2 192 Transducer interface block diagram

[Page 82] 4.1.2 TX The TX board generates the transmission signals for all the transducers other than the pencil transducer. Each TX board has 96 channels and together they transmit 192 channels. The transmission signals are sent to the transducer via the TI board. (2) Description of functions and operation (a) Transmit pulser This circuit drives the piezoelectric elements inside the transducer electrically. The number of transmission waves and the pulse duration are controlled by the TXPG. The transmission pulse is generated in the low-voltage power supply and then increased in the transformer (bipolar transmission). In addition, this pulser has the two power supplies (VTX0 and VTX1) for transmission. Each power supply is applied to each of the two primary coils in the transformer. This allows transmission voltage switching for each rate (dual pulser). (b) Pecl clocks The following two pecl clocks are provided. <1> 4-phase and 40-MHz pecl clock (RCFECK[0:3]) <2> 1.25-MHz synchronization signal, which becomes low every 32 clocks of RCFECK0: RCFECKE+/- The source of the pecl clock is the RC board. The pecl clocks are used in the TX board in the following ways. <1> 4-phase and 40 MHz (RCFECK[0:3]), RCFECKE+/- Æ Used for TXPG transmission pulse <2> RCFECK0 is converted to TTL and then used as follows via the clock driver. • EPLD and JTAG IF EPLD clocks • Clock detector (c) TC (Transmit Control) bus interface The TX board exchanges the transmission control signal, board information, and firmware information with the RC board via the TC bus. The transmission control signal is received in the address decoder EPLD in the TX board and then written to or read from the TXPG. The board information and firmware information are written to or read from the ID EEPROM. I/O control of the ID EEPROM is performed by the address decoder EPLD. The TC bus has two 16-bit bidirectional data buses (RCTC0D and RCTC1D) and an 18-bit address bus (RCTCA).

[Page 83] (d) Fault detection and protection circuit The TX board generates two types of interrupts: transmission interrupts and clock detection interrupts. <1> Transmission interrupt A transmission interrupt is generated when TXEN0 and TXEN1 are both "H" simultaneously. This occurs only if there is a hardware fault or if the address decoder test bit is set. The address decoder EPLD always monitors the TXEN0 and TXEN1 lines and sets the interrupt status bit when it senses that both signals have become "H" simultaneously. When this bit is set, the TX board stops transmission by making TXEN0 and TXEN1 "L" and transfers the transmission inhibit signal (/TXDIS) and the interrupt signal (/RCTCIRQ) to the system simultaneously to indicate that a system malfunction has occurred. This disables transmission to both TX boards, not just the TX board where the error occurred. <2> Clock detection interrupt A clock detection interrupt is generated when the pecl clock in the front-end unit stops before the TXPG completes transmission. This leaves the TXPG output signals in an incorrect state and as a result, the transmission circuit may be damaged. When this interrupt occurs, transmission is discontinued and an error message is displayed on the screen..

[Page 84] TX board block diagram

[Page 85] 4.1.3 RX board (1) The RX board amplifies the echo signals from the TI board and transmits them to the RC board. (2) Description of the functions and operation (a) Limiting circuit The limiting circuit consists of diodes and prevents the transmission pulse from being applied directly to the preamplifier during transmission. (b) Reception resonance Reception resonance is achieved by placing inductance coils in parallel in echo signal lines. A coil is connected between the echo signal line and GND. In addition, there are three other inductance coils that can be selected. The resonance can be changed by using these four inductance coils in various combinations. (c) RXSW The RXSW in the RX board selects and connects the 192-channel echo signal lines from the TI board to the 128-channel preamplifier. (d) Low-noise amplifier (LNA) and variable gain amplifier (VCA) (functions in the preamplifier) These amplifiers amplify the echo signals from the TI board. The gain in the low-noise amplifier is fixed to +19 dB. The variable gain amplifier together with the low-noise amplifier sets the gain from +7.5 dB to 55.5 dB by changing the control voltage (VTGC) from 0 V to 1 V. (e) LNA/VCA select SW This switch selects the output signal from the RX board between the LNA and VCA. The LNA output is selected in SCW mode and the VCA output is selected in other modes. (f) RX FPGA The RX FPGA decodes the addresses from the TC Bus and performs the control necessary for the RX board. (3) Comparison with Xario Item Xario AplioXG TI control function Implemented on the RX Implemented on the TI board board. itself.

[Page 86] RX board block diagram

[Page 87] 4.1.4 RC board The RC (Receive Control) board controls the front-end section, AD-converts the reception signals, and performs signal phasing/addition. (2) Descriptions of functions and operations The RC board includes the following functions. (a) Front-end section scan control: RTC (Real Time Controller) block The transmission/reception in the front-end section is controlled according to control information from the MA. The RTC block consists of an FPGA (Field Programmable Gate Array; programmable IC) and SRAM. The sequencer in the FPGA transmits data to each block of the front-end section and controls scanning according to the control information stored in the register in the FPGA and the SRAM. (b) AD conversion and phasing/addition of reception signal: RXBF (Receive Beam Former) block The reception signal for each channel is AD-converted with a sampling frequency of 40 MHz and a quantification precision of 10 bits. The required reception delay is applied to each converted signal and then the signals are added. This block consists of 8 ASICs (RXBF ASICs). (c) Analog control signal generation: Analog Control block The analog control signals required in the front-end section (listed below) are generated. They are obtained by DA-converting the digital codes output from the RTC. • VTGC (time gain compensation) This signal controls the preamplifier gain depending on the depth of reception. This signal is input to the preamplifier IC in the RX board. • TXV (transmit voltage control) This signal controls the transmission pulse voltage. The signal is input to the TX board via the power supply unit. • VMD (voltage for midpoint bias) This signal controls the bias point of the reception echo signal line. (d) Anti-aliasing filter: Analog Echo Receive block This is a low-pass filter that prevents the aliasing that occurs when the analog echo signal is converted into a digital signal. (e) System clock generation: Clock Generation block The clock to be used in the system is generated. A 40-MHz clock is generated by dividing the 160-MHz crystal-oscillator output.

[Page 88] (f) Self-diagnosis: Diagnostic Circuit block The line voltage and reference voltage in the front-end unit are measured for self- diagnosis of the system. This block also includes the function for detecting the temperature of the TEE transducer head and angle of the piezoelectric element surface. The signals to be measured are selected by the multiplexer and are input to the AD converter. The converted data is transmitted to the MA via the RTC. A separate circuit that stops transmission forcibly when a certain temperature is reached is provided for the transmission voltage and TEE transducer head temperature detection signals. (g) Working bus The working bus signals that control the aperture of the 1.5D transducer are transmitted to the TI board. (3) LED An LED (DS1) is set at the free edge on the RC board. If this LED lights, the FPGA of the RTC is configured (programmed). The FPGA is automatically configured when the power supply is input. Therefore, if the LED does not light even when the power supply is input, the RTC circuit is not configured and therefore the system does not operate. This problem may occur as a result of contact failure of the FPGA terminal, device failure, or failure of the ROM that stores the program. (4) Error detection The RC board detects the errors described below. (a) Excessive transmission voltage detection The RC board monitors the transmission voltage output from the power supply unit to the TX board by the TXV as described above. If this control signal exceeds a predefined limit value, the RC board generates an error and stops transmission. The limit value is set in the register in the RTC by the MA.

[Page 89] (b) TEE transducer head high-temperature detection The RC board is provided with a function to detect the temperature of the TEE transducer head. If the temperature exceeds 43°C, the RC board outputs an error and stops transmission. In addition, since the RC board mainly controls the front-end unit, it temporarily receives an error output from the TX, RX, CB, or MC board. The RC board then outputs an interrupt request to the MA. (5) Comparison with Xario A control circuit for the 1.5D transducer has been added. Analog Analog echo signals RXBF Digital RF echo signals to BE echo 128 ch (ASIC x 8) (4 pareIlel data with different profiles) Receive VMD uP_ BUS Header BUS TC BUS to TI, TX, RX, CB, and MC Working Bus to TI RTC Analog VTGC Control TXV (FPGA & SRAM) Diagnostic Circuit Measurement BUS from Front-End Block Measured results Front-End Clocks Clock Back-End Clocks Generation ADC Clocks RC board block diagram

[Page 90] 4.1.5 CB board 4.1.5.1 Outline The CB board performs SCW Doppler reception signal processing and pencil CW transmission/reception. This board supports SCW Doppler reception processing for a maximum of 64 channels. The processing operations are outlined below. (1) SCW Doppler reception • Buffering of the signal output from the preamplifier in the previous stage (CB board input signal) • Applying a delay to the reception signal for each channel and performing addition of these signals (beam forming) • Band-pass filtering for the summed signals • Quadrature detection • High-pass filtering for the baseband signal (I/Q) (clatter filter) • Amplifying the baseband signal • Anti-aliasing filtering • AD conversion • Outputting the I/Q digital signal to the next stage (2) Pencil CW Doppler transmission/reception • Generating the transmission signal • Amplifying the reception signal (The following functions are the same as those for the SCW.) • Band-pass filtering for the summed signals • Quadrature detection • High-pass filtering for the baseband signal (I/Q) (clatter filter) • Amplifying the baseband signal • Anti-aliasing filtering • AD conversion • Outputting the I/Q digital signal to the next stage

[Page 91] (3) Control-related processing • Inputting the pecl clock and converting to the CMOS/TTL level signal • Reception of the control signals, decoding of commands, and execution of the requested control processing (Control bus interface) • Generating the mixing signal for quadrature detection • Selecting and outputting the on-board line voltage monitoring signal (The following functions are for system self diagnosis) • Generating the pencil CWD reception circuit test signal and inputting it to the circuit • Outputting the pencil CWD transmission signal to the test circuit in the next stage

[Page 92] 4.1.5.2 Block diagram of the CB board Differential output to BE board Serialized digital signal Data combiner ADC ADC LPF LPF Several control signals necessary for the circuits Gain Gain Baseband gain control Control BPF BPF Bus Control Interface Mixer Control To PECL TTL BPF ID Selectable Control PROM generator 2 (TXPG ASIC) Reference signal 4 2 MUX Control SCW/Pencil PECL Buffer TC bus Address: 18 bits Data: 16 bits 4 2 Adder PECL clocks Clock enable Test signal output to RX board & & Adder Adder Delay line Delay line <Pencil Tx/Rx> 16 16 x 4 x 4 MUX Control 8 x 16 MPX 8 x 16 MPX Gain Control Attenuator <SCW beamformer> Transmitter Test signal buffer <Diagnostic Circuitry> & & Buffer Buffer Control Transformer Transformer Relay Control Relay p/n x 32 p/n x 32 Power supply voltage Monitoring signals Differential inputs from RX board Pencil transducer CB board block diagram

[Page 93] 4.1.5.3 Composition and operation of each block (1) Transformer and buffer The output of the preamplifier on the RX board is input to the CB board during SCW Doppler mode. Since the output is input as a differential signal, it is converted into a single-end signal in a 1:1 transformer, buffered in the emitter follower, and then output to a circuit in the next stage. (2) MPX It is necessary to add a delay time associated with the sound propagation time between the piezoelectric element and focus to the input signal for each channel. This is achieved by the delay line, which determines the delay amount according to the selected input tap. The MPX (multiplexer) selects the tap for input of the reception signal (the delay amount to be added). The MPX uses eight cross-point switch ICs with 8:16 input/output to assign the 64-channel signals to the 16 relay taps. (3) Delay Line and Adder This block is consists of the delay lines described above. The MPX output signal is input to the grounded-base transistor and the output current is transmitted to the delay lines. When the required delay is added to each tap input signal of the delay line, the currents are added and converted back to the voltage by the resistor in the output. (4) Adder The processing described above is performed in two systems, each of which consists of 32 channels. The results are summed in this block and final beam forming for a maximum of 64 channels is completed. The signals are set to current mode by the grounded-base transistor and then the currents are added. (5) SCW/Pencil MUX The processing operations (1) to (4) above are performed during SCW Doppler mode. In pencil CW Doppler mode, a separate processing system is used to receive and amplify the signals. The subsequent processing is the same as that for SCW Doppler mode. The signals to be transmitted to the next stage are selected in this block, which consists of analog switches. (6) Selectable BPF The signals in the band near the carrier frequency are transmitted to the next stage using the BPF (Band-Pass Filter). To accommodate the differences in carrier frequency depending on the transducers, BPFs with the following center frequencies are provided. The control signal switches the filter to that optimal for the selected transducer. 2.02 MHz 2.92 MHz 4.32 MHz

[Page 94] (7) Mixer The signals are converted into baseband I/Q signals using the DBM (Double Balanced Mixer). The mixing signal (LO input) is output from the dedicated IC described later. (8) BPF The low-pass characteristics eliminate the sum components of the mixer output, while the high-pass characteristics eliminate the Doppler components other than the blood flow contained in the reception signal. The latter is a clutter filter, which eliminates unnecessary components derived from the motion of the heart or other organs. This block consists of 4th-order active filters. (9) Baseband Gain Control The signal is increased to an adequate level before AD conversion in order to suppress NF deterioration due to quantum noise. This block employs a noninverting amplifier composition using operational amplifiers to allow the following gains to be set by switching the resistors. 0 dB 2 dB 4 dB 6 dB 8 dB 10 dB 12 dB 14 dB 16 dB (10) LPF (Anti-aliasing filter) This block is an anti-aliasing filter used before AD conversion. The sampling frequency in the AD converter is 312.5 kHz and the cutoff should be set to a frequency lower than the half of the sampling frequency. This block consists of 4th-order active filters and the cutoff frequency is set to approximately 150 kHz. (11) ADC & Data Combiner The analog signal processed above is converted into a digital signal in this block and then transmitted to the digital signal processing circuit in the next stage. This block uses a high-precision AD converter featuring 16-bit resolution and serial output mode to accommodate itself to the specifications for serial output to the next stage. In addition, this block outputs I/Q by a single-system signal (I component first and then the Q component) and combines ADC outputs using a data combiner (actually, the employed AD converter supports this function and therefore it combines the output signal lines and controls them properly).

[Page 95] (12) Pencil Transmitter & Receiver A separate processing system is provided for pencil CW Doppler. • For SCW Doppler, the preamplifier on the RX board is the first stage amplifier. For pencil CW Doppler, the preamplifier is implemented on the CB board. • Beamforming is not required and therefore the signals are not passed through the delay line etc. • The transmission circuit for SCW Doppler is provided on the TX board, while that for pencil Doppler is provided on the CB board. The transmission circuit receives the transmission voltage from the power supply unit and the transmission clock from the Reference Signal Generator (which is described below), and then generates bipolar transmission pulses by FET switching and by using a transformer. The reception circuit is a preamplifier whose output is sent to the quadrature detection circuit used for SCW Doppler. The reception circuit is a low-noise operating amplifier (amplification of approximately 20 dB). (13) Reference Signal Generator (TXPF ASIC) This block generates the mixing signal (LO signal to the mixer) for quadrature detection and the transmission clock to the pencil transmission circuit using the specially developed IC (TXPG ASIC). The TXPG ASIC is controlled through the Control Bus Interface to generate clocks of arbitrary frequencies with a precision of 160 MHz (6.25 ns) based on a 40-MHz 4-phase clock. (14) Control Bus Interface The CB board is controlled via the TC (Transmit Control) bus, which decodes the commands and performs the requested control. This circuit is consists of a single large-capacity PLD (Programmable Logic Device). (15) ID PROM This block stores the serial number, board revision, firmware revision, and other board information. It also stores the correction data used for correcting the differences in gain and phase between I/Q signals. These correction data are transmitted to the correction circuit in order to suppress the so-called mirror component on images.

[Page 96] 4.1.6 MC board The MC board drives the motor in the Mecha 4D transducer and makes the piezoelectric element array inside the transducer sweep. It then transfers the sweep angle information that is necessary for 3D image creation to the system in real time. (2) Description of functions and operation (a) Drive circuit for the motor in the Mecha 4D transducer The Mecha 4D transducer contains a motor that makes the piezoelectric elements sweep. This drive circuit transmits the drive signal for the motor. The control signal for the drive circuit is supplied by the USMC FPGA. (b) PECL Clocks The following two types of PECL clock are provided. <1> PECL Clock with 2 phases × 40 MHz: /RCBECK ± <2> Sync signal that becomes low every 32 clock cycles of /RCBECK+: /RCBECE ± The clock source is the RC board. These PECL clocks are used as follows in the MC board. <1> The /RCBECK ± and RCBECE ± signals are converted into TTL and then distributed to the PLD and TCIF by the clock driver, for synchronization with the system. <2> The /RCBECK ± signal is converted into TTL and distributed to the USMC by the clock driver to lock the PLL. (c) Transmit Control Bus (TC Bus) Interface The MC board communicates with the RC board through the TC bus to read/write the motor control signal, board information, and firmware information. The TC bus is connected to the TCIF (TC bus interface) FPGA. It consists of the bidirectional data bus: RCTC0D, address bus: RCTCA, Enable: /RCTCWR and /TCRCEN, and Acknowledge: /TCRCACK. The board information and firmware information are read from and written to the ID EEPROM (IDPROM). (d) The MC board communicates with the RC board through the TC bus to exchange the transmission control signal, board information, and firmware information. The TC bus consists of two 16-bit bidirectional data buses (RCTC0D and RCTC1D) and an 18-bit address bus (RCTCA).

[Page 97] (e) Fault detection and protection circuit When a fault occurs in the MC board, this circuit sets the /TCRCIRQ signal to low to inform the CPU of the fault via the RC board. The MC board outputs an interrupt in the following cases. <1> When a clock detect fault has occurred The clock supply to the USMC is intentionally stopped when the Mecha 4D transducer is not being used in order to avoid noise effect on other transducers. If the clock supply is stopped even though the Mecha 4D transducer is being used and clock supply to the USMC is expected, a fault results. <2> When the motor’s condition has become abnormal A fault results if the motor of the Mecha 4D transducer does not operate normally within the specified time. The USMC detects the fault and notifies it to the TCIF. <3> When a parameter setting error has occurred A fault results if the operation-designating parameter for the motor of the Mecha 4D transducer is abnormal. The USMC detects the fault and notifies it to the TCIF. When any of the above faults has occurred, the TCIF sets the interrupt status register bit predetermined to correspond to the fault to "1" asynchronously. The interrupt status register is located on the TCIF board. At the same time, the TCIF sets the /TCRCIRQ signal to low. The CPU then starts interrupt handling. The TCIF no longer outputs an interrupt when the interrupt mask register inside the TCIF is set to "1" as the CPU has started interrupt handling. In case of fault <1>, when the fault status is removed and the predetermined bit of the interrupt clear register in the TCIF is set to "1", the interrupt status is returned to "0" and the /TCRCIRQ signal is set to high. In case of fault <2> or <3>, when the predetermined bit of the interrupt clear register in the USMC is set to "1", the interrupt status is returned to "0" and the /TCRCIRQ signal is set to high.

[Page 98] (3) Block diagram SRAM USMC MC motor drive filter SRAM Angle trigger receiver MC motor drive circuit EN USMC JTDO USMEAH USMEBH USMEZH V500KP V500KN V500KEL MOTORBH MOTORBL MOTORAH MOTORAL USMA[16:0] USMD[15:0] USMWE0 USMWE1 USMCS USMOE Angle trigger 12 V control Motor drive signal SRAM control  @ FPGA USMC P L L EP1C6 TDI TDO ROM TDI EPC2 ARESET USMC_PLL_EN USMC_PLL_LOCK0 USMC_PLL_LOCK1 IORDL0 IOWRL1 IOWRL0 USMC_CS UPBUSYH USMC_RST HD_1[15:0] HFA_1[18:1] TDO USMC_CNS,USMC_DS (2:0), USMC, INS MS0FENH,ANGINFDIR,ANGLE(10:0) USMC_IS(1:0) USMC_CONF PLL control USMC REG Data USMC BUS I/F EP1C6 TCIF FPGA TDI WEROM0 OEROM0 TDO ROM N12A (MC drive power supply) ID EEPROM P12A (MC drive power supply) JTMS,JTCK,JTRST JTDI0 EPC2 CLK_DETECT P5A (for MC transducer) Tr JTAG EMI filter MUXEN1,MUXA[3:0] CJTD0,CJTDI,CJTMS0,,CJTCK JTD10,JTMS,JTCK,JTRST @ P5D1 CLK2 SYNC3210 CLK3 SYNC3220 USMC_CLK USMC_CLK_OE TCRST0 TCWR0 TCEN0 TXSTART0 FD[15:00]1 A[19:02]1 CLK_MONITORED2 P1.5D (FPGA core power supply) JTAG PLD EPM3032A  DATABUFDIR Buffer Analog MUX P12A P5A P5D1 P3.3D P1.5D N12A Clock RCV/DRV Regulator Regulator Regulator P3.3D P3-3AQ P5AQ P14AQ M14AQ P5MC MCOT_USMDV0A,U0A MCOT_USMDV1A,U1A XOT_A,XOT_B,XOT_Z RCMCUSMDRVEN (not used) MCGA[2:0] RCFETDO /RCTRS /RCTEN /RCTMS FERCTDI RCTA[2:0] /TCRCIRQ /TCRCACK /TXDIS (input only) /RCTCRST /RCTCWR /RCTCEN /RCTXCL (not used) RCTC0D[15:0] RCTCA[19:2] RCBECK RCBECE FERCMSR FERCMSRR BP Power supply MC motor interface JTAG interface TC BUS interface Clock Analog interface

[Page 99] 4.2 BE Unit This unit consists of a processing system for the echo signals input from the FE unit, the video signal processing system, the audio signal processing system, and the CPU assembly that controls the system. (2) Composition This unit includes the following boards. • CPU assembly System control board with CPU • BE board Display processing board for echo and overlay images • VP board (option) I/F board for analog VCR/DVD • I/O board I/F relay board between external and internal boards. • IQDAS board Raw data acquisition board (3) Flow of signals CPU assembly MA board ATX motherboard PB board AGP card USB bus PCI bus USB device DVI RGB USB device Echo/flow PANEL TCS FE unit signal Video signal processing processing RGB Monitor DVI LCD Trace signal DVI processing DVD Y/C VCR Physio unit IO BE Raw data acquisition Decoding Encoding Control signal (A/D) (D/A) Image signal Acquisition memory VP (option) IQDAS (option) Flow of signals in the BE unit

[Page 100] 4.2.1 CPU assembly This PWB contains the host CPU, whose main function is to execute software programs. The PWB also includes the I/Fs with external memory units such as the HDD and the input/output I/Fs such as those for Ethernet and USB. (2) Composition (a) CPU and chip set An Intel Pentium 4 processor and an Intel865PE chip set are installed. (b) Main memory Up to four DDR memory modules can be mounted. (c) Graphics card The graphics card connected by the 8X AGP I/F outputs various graphics and characters as 24-bit digital RGB signals. These graphics and characters are combined with the ultrasound image in the VI board and then displayed on the monitor. (d) Audio card This card performs recording and playback for various audio signals. (e) I/Fs The I/F controller functions listed below are provided. The I/Fs are connected to each device via the BP board. • PCI : Connected to the BE and VI boards in the 64-bit PCI bus through the PCI bridge. (A 32-bit PCI bus is connected internally.) • IDE : Supports the Ultra ATA/100 and is used for connection to the HDD. • USB : Supports USB 2.0 and is used for connection to the operating panel and external USB devices. • Ethernet : Supports 10/100Base-T Ethernet. (3) LEDs The following LED is provided at the free edge of the PWB to indicate the PWB status. • PWR (green) : Monitors the power supply status and lights when the power is ON. During the standby status, this LED blinks.

[Page 101] (4) Jumper setting When this PWB is used, the jumpers should be set as follows. • JPUSB : USB Wake-Up (always disabled) Short between pins 1 and 2 on the PS2 port side of JPUSB, which is located next to the PS2 mouse port. • JPWAKE : Keyboard WakeUp (always disabled) Short between pins 1 and 2 on the PS2 port side of JPWAKE (jumper inside the ATX), which is located next to the JPUSB. • J2, J3 : FSB Speed (Auto) Short between pins 1 and 2 on the LAN port side of J2 and J3, which are located near the LAN port. • JP1 : Overheat Fan Force-On (always disabled) Open JP1 near the PCI slot (the jumper on the PCI1 side). • JP20 : Force Power-On (always disabled) Open JP20, which is located next to JP1. • JP4 : WatchDog (WD to NMI) Short between pins 2 and 3 on the IDE side of JP4, which is located near the IDE connector.

[Page 102] 4.2.2 BE board The BE board consists of the following blocks and performs data processing in all video modes after performing phasing/addition. a) DR (Digital Receiver) b) EP (Echo Processor) c) FP (Flow Processor) d) SIP (Signal & Image Processor) e) SC (Scan Converter) f) Physio unit I/F g) VPDM (Video Processor Display Manager) h) CPU overlay DVI decoder i) System video display mode controller j) Variable video resolution controller k) SVGA RGB encoder for system monitor l) DVI encoder for LCD/DVD m) RGB/YCbCr converter n) YCbCr JPEG compression o) 64-bit PCI bus interface p) JTAG boundary scan interface q) Doppler audio D/A converter r) Bus interface s) BE board information storage (IDPROM) The features of the architecture of this board are the miniaturization of circuits using an ASIC with a high level of integration and the provision of a buffer memory for each block to enable independent data processing.

[Page 103] (2) Functions The composition and functions of each block in the BE board are described below. (a) DR This consists of four DR-ASICs for receiving four beams simultaneously. The following functions are performed in all modes. • DC filtering Eliminates the DC components. • Digital TGC (Time Gain Control) Controls the STC. • Baseband conversion Performs quadrature detection according to the reception center frequency data and converts the frequency to the baseband signal to obtain real and imaginary signals. • Decimation filter Performs decimation for input data with 1024 samples or less per vector. • Dynamic filter Sets the LPF to the echo signal depending on depth. In addition to the above functions, the following function is also performed in the PWD mode. • Range gating Range gating integration is performed for the sample volume. (b) EP This consists of one EP-ASIC and a persistence memory. The EP operates in 2D-mode and M-mode and performs echo signal processing as outlined below. • Magnitude calculation Power operations are performed for real and imaginary input data. • Log compression Log compression is performed for the echo signal. • Blending Combination focus and other vector combination operations are performed. • Edge enhancement Edge enhancement is performed for the echo signal. • AGC Feedback processing and echo enhancement are performed for the echo signal.

[Page 104] • Black hole and noise spike filtering Noise that appears as black and white dots is eliminated. • Persistence Frame correlation processing is performed. (c) FP This consists of an FP-ASICU, a buffer memory, an FPGAU, a filter coefficient memory, and a persistence memory. FP operates in CDI mode and MCDI mode and performs color Doppler processing. • Corner turning Real and imaginary data inputs from the DR are stored in the buffer memory and they are rearranged for processing by the MTI filter. • Wall filtering MTI filtering is performed. FIO, which reduces motion artifacts, is also performed. • Autocorrelation Auto-correlation is performed. • Spatial averaging The filter to be used in spatial averaging (smoothing) is set. • Hole filtering Filtering and blanking are performed to remove clutter and noise. • Persistence Frame correlation processing is performed for the Color Doppler data. • Clutter processor Analysis is performed for the removal of clutter components by FIO. (d) SIP This consists of one DSP, one FPGA, and a buffer memory. SIP operates in trace image display modes (PWD, CWD, M, and MCDI) and at the time of waveform (such as ECG) display. The SIP FPGA controls output of the raw data acquisition data to the IQDAS board. In PWD and CWD modes, the following processing operations are performed. • Spectrum generation (FFT) Signal analysis is performed by the FFT and a spectrum is generated. • Audio left/right signal generation Separate left and right Doppler sounds are generated. • Display column generation The column for spectrum display is generated.

[Page 105] • Derived parameter calculations Real-time calculation such as auto-tracing performed. In the M and MCDI modes and at the time of waveform display, the following processing operations are performed. • Display column generation The column for waveform display (such as M, MCDI, and ECG) is generated. • Tissue/flow decision (only for MCDI mode) Whether the pixels displayed in CDI mode represent tissue or blood flow is determined. (e) SC This consists of the one SC-ASIC, a CINE memory, and a buffer memory. SC operates in the 2D and CDI modes and performs the following 2D image processing operations. • Scan conversion Ultrasound data is converted to TV format data. • Tissue/flow decision Whether the pixels displayed in CDI mode represent tissue or blood flow is determined. • Peak hold (only for BCDI mode) A maximum value is displayed for each pixel in CDI mode. • Frame interpolation (only for BCDI mode) Frame interpolation is performed in CDI mode. • 2D cine storage The 256 MB cine memory is included. • Cine replay (under CPU control) Cine display is performed. Operations such as playback speed are controlled by the CPU. (f) Physio unit I/F Data communication with the physiological signal display unit is performed using serial interface. (g) VPDM This block overlays the echo data from the SC, the overlay data from the CPU, the Doppler data, and the Physio data, and outputs the image to the monitor or other peripheral unit and to the CPU system memory. (h) CPU overlay DVI decoding This block has a circuit for decoding the DVI data for overlay that is input from the CPU. The DVI signal is decoded and then converted into 24-bit RGB data.

[Page 106] (i) System video display mode control The pixel clock and frame rate are changed properly for NTSC or PAL mode. NTSC : Pixel clock 40.5 MHz, frame rate 60 f/s PAL : Pixel clock 54.0 MHz, frame rate 75 f/s (j) Variable video resolution control The following resolutions are supported. 600 × 480 (VGA), 800 × 600 (SVGA) (k) SVGA RGB encoding for system monitor The VPDM operates the system monitor via the triple 8-bit video DAC to display the ultrasound image. (l) DVI encoding for LCD/DVD One DVI output for the LCD monitor and another for the DVD/VSR recording device are provided. (m) RGB/YCbCr conversion • RGB Æ YCbCr conversion The RGB signal to be output to the VP board for the analog VCR I/F is converted into a YCbCr signal (4:2:2). • YCbCr Æ RGB conversion The YCbCr signal (4:2:2) input from the VP board is converted into an RGB signal. (n) YCbCr JPEG compression The function of this block is to compress the YCbCr signals that are output from the VPDM to JPEG format. This JPEG compression circuit is included in the SC FPGA. It is possible to change the compression ratio by rewriting the quantization table from the host. The JPEG compression image is saved and played back on the Clip acquisition image. (o) 64-bit PCI bus interface The host accesses the BE unit and FE unit via the PCI bridge in the BE. The host side of the PCI bridge is the primary bus and the BE side is the secondary bus. The secondary bus includes two PCI devices (SC FPGA (BeDriver)) and a VPDM ASIC (VpdmDriver). The primary PCI bus operates at 32 bits, and the secondary PCI bus operates at 64 bits.

[Page 107] (p) JTAG boundary scan interface The host can access devices provided with the JTAG interface. All the JTAG connections to the FE units and VP board go through the JTAG controller in the BE. The JTAG interface is mainly used to write the PLD and FPGA data of each unit from an application. (q) Doppler audio D/A conversion Doppler audio data processed by the DSP in the SIP block is converted into L and R analog signals. (r) Bus interface • Imaging bus FE Æ DR : RF data bus, 18 bits × 4 directions, 40 MHz DR Æ EP/FP/SIP : IQ data bus, 32-bit, 40 MHz EP Æ SC : Echo data bus, 16-bit, 40 MHz FP Æ SC : Flow data bus, 16-bit, 20 MHz SC Æ VPDM : Echo/flow data, 64-bit PCI bus, 33 MHz SIP Æ VPDM : Trace data, 64-bit PCI bus, 33 MHz VPDM Æ Monitor : Analog RGB VPDM Æ LCD/DVD : DVI VPDM Æ VP : YCbCr data, 8-bit, Pixel CLK • BE internal local bus This is an internal local bus used for controlling ASICs etc. : 32-bit, 40 MHz • FE bus This is used by the CPU to access boards in the FE unit. : 32-bit, 40 MHz (s) BE board information storage (IDPROM) The IDPROM has a serial ROM for storing the board revision and serial number. The serial ROM is connected by a serial bus together with the CPU assembly and the IO board IDPROM. The ROM capacity is 4 Kbits.

[Page 108] (3) Flow of the signals The following figures show the flow of signals in each mode. Axial EE Blending Black Hole Noise Spike T/R IO BOARD Log EE Lateral Compress Tx Monitor Video Routing Pre-Amp Mag Calc Persist EP ASIC Tx TGC Storage Mixer TXPG ASICs Beamformer Analog Dynamic Color Key Scan Convert Decimator SC ASIC RGB Lookup VRDM ASIC Baseband Conversion Pixel Pack Pixel Rx Beamformer RXBF ASICs Graphics DC Filter Controller Real-time Manager Flow of signals in 2D mode

[Page 109] Adaptive Keyhole Keyhole Vel/Var/ Power Clutter Signal 2D Spatial Adaptive Control Axial Filter T/R Switch IO BOARD Proc. Persist Clutter- Auto- Corr. Tx Pulser Cine Storage Pre-Amp Control Wall Filter FP ASIC Scan Monitor Video Routing Adaptive Convert Tx Frame Interp TGC TXPG ASICs Beamformer Analog Filter Dynamic Mixer TX BOARDs RX BOARD Color Key Shading Decimator RGB Lookup Tisse/ Flow SC ASIC Rx Baseband Conversion Pixel RXBF ASICs Peak Hold Beamformer DC Filter Pixel Pack RC BOARD Cancel DR ASIC Flow of signals in CDI (B) mode

[Page 110] Audio Amps BE BOARD Filter DSP Welch Proc. Median IO BOARD Audio Mixer T/R Cine Switch Storage Root FFT Square Mic In Tx Pulser Monitor Video Routing Missing Signal Wall Filter Estimate Pre-Amp IFFT Mixer Tx VPDM ASIC Color Key TGC Range Gate Integ. TXPG ASICs Beamformer Analog Sweep Smooth Display Column Display Formatter RGB Lookup Decimator Auto Calcs Pixel L/R Audio Generate Baseband Conversion Rx LPF Pixel Pack 3200 Buffer Beamformer RXBF ASICs Column DACs RTC SUBSYSTEM Tx Beamformer Control Rx Beamformer Control Analog Control BE Header Generation FE Header Generation Stereo Audio DC Filter Flow of signals in PWD mode

[Page 111] Audio Amps BE BOARD Filter SIP/DSP Welch Proc. Median Transducer Signal Routing IO BOARD Audio Mixer Storage Root FFT Square Mic In Switch Monitor Video Routing Missing Signal Wall Filter Estimate Tx IFFT Mixer Pre-Amp VPDM ASIC Color Key Down Sampling Tx Sweep Smooth Display Column Display Formatter RGB Lookup TXPG ASICs Beamformer Serial Parallel TR BOARDs RX BOARD Auto Calcs Pixel L/R Audio Generate LPF Pixel Pack 3200 Buffer Column DACs Stereo Audio Rx Beamformer RTC SUBSYSTEM Tx Beamformer Control Rx Beamformer Control Analog Control RC BOARD CB BOARD Flow of signals in CWD mode

[Page 112] Noise Spike Transducer Black Hole Axial EE IO BOARD Log Compress Tx Pulser Monitor Video Routing Pre-Amp Mag Calc EP ASIC Storage Mixer Tx Color Key TGC Filter TXPG ASICs Beamformer Analog Dynamic Peak Hold Detect/ DSP Sweep Display RGB Formatter Lookup Decimator Display Column Pixel Baseband Conversion Rx Beamformer RXBF ASICs Pixel Pack 3200 Buffer Column VPDM ASIC DC Filter Flow of signals in M mode

[Page 113] BE BOARD Keyhole Key hole Vel/Var/ Power Transducer ID Spatial Axial Filter IO BOARD Auto- Corr. Monitor Video Routing Tx Wall Filter Pre-Amp FP ASIC Mixer Color Key Tx TGC TXPG ASICs Beamformer Analog Filter Cine Dynamic Storage RGB Sweep Display Lookup Formatter Flow Tissue/ Decimator Pixel DSP Display Column Rx Baseband Conversion 3200 Buffer Column Beamformer RXBF ASICs Pixel Pack DC Filter Graphics Controller RC BOARD Cancel CPU-ASSY DR ASIC Flow of signals in CDI (M) mode

[Page 114] (5) Block diagram RGB DVI X2 VPDM BUFFER YCBCR OUTPUT/FROM VP BOARD DVI PCI BUS RECEIVER FE BUS TO RC DSP LOCAL SDRAM DVI BOOT PROM FACE ID PROM PCI INTER (SC FPGA) SDRAM OUTPUT TO PHYSIO TRIGGER CONTROL PCI DSP 6713 BRIDGE DSP INPUTS FROM CPU ASSY 40 MHz TTL CLOCKS SIP FPGA ROUTER CLOCK BUFFER SC ASIC SC SDRAM RCBECK PECL CLOCK FP SRAM FP FPGA FOR PERS FE TEST BUS BE TEST BUS BUS EP SRAM EP ASIC JTAG TEST CONTROL LOCAL/MICROPROCESSOR BUS FP SRAM FP ASIC B ENABLE M ENABLE B/M DATA SIP FPGA (4) DR ASICS PHYSIO INPUT INPUT FROM CB BOARD INPUTS FROM TR BOARDS CH0

[Page 115] 4.2.3 VP (Video Processor) The VP (Video Processor) board processes the NTSC/PAL video signals to support external OEM devices. (2) Functions The functions implemented by the VP are outlined below: • Video processor image formatter (FPGA) • Bidirectional scaling engine for NTSC/PAL • NTSC/PAL video decoding • NTSC/PAL video encoding • Simultaneous S-video, composite, and RGB analog output for NTSC/PAL • 64 bit, PCI bus interface • JTAG boundary scan interface (3) Explanation of the block diagram The top-level functional block diagram of the VP board is shown at the end of this subsection. The board includes one PCI master/target device and a VPIF (video processor image formatter) decoder FPGA. The PCI master/target interface in the device supports 64-bit address/data transactions at a 33-MHz bus speed. The PCI bus also allows the VPDM ASIC and the decoder FPGA to communicate with each other. The 16-bit data bus from the VPDM ASIC in the BE board to the VPIF encoder FPGA carries 16-bit YCbCr (4:2:2) non-interlaced video data with a resolution of 800 × 600 pixels. The VPDM sends video data that contains the video information displayed on the system monitor to the VPIF, where the data is converted to the NTSC/PAL image size and format and is then routed to the IO board. The NTSC/PAL video encoder receives image data in the 4:2:2 YCbCr format from the VPIF encoder FPGA and converts it to analog signals for an external monitor or VCR. The output analog signals are Y and C, color composite, and component RGB. The NTSC/PAL video decoder converts analog Y/C signals from an external video device to image data in the 4:2:2 YCbCr format. This image data includes the horizontal and vertical synchronization signals, the field ID, and the blanking information. The VCR video data decoded in VCR playback mode undergoes size conversion followed by conversion to non-interlaced video data in the VPIF decoder FPGA, and is then sent to the VPDM via the PCI bus.

[Page 116] (4) NTSC/PAL encoder interface The "encoder" interface block refers to the external digital video encoder section used to generate NTSC/PAL analog video signals. The 16-bit YCbCr data is converted into the CCIR-601 4:2:2 8-bit digital video format, which includes synchronization codes. This block also outputs a discrete blanking signal and horizontal and vertical synchronization signals for diagnosis. The digital video output from the encoder FPGA includes additional blank lines and pixels to avoid overscan problems in playback monitors. The NTSC timing is shown in the following table. External NTSC Parameter Pixel clock cycles Time Pixel clock 1 74.07 ns (13.5 MHz) Line active 692 63.556 μ s 81% Line FP 28 2.074 μ s Line sync 64 4.74 μ s Line BP 74 5.48 μ s Line blanking 166 12.296 μ s Line time 858 (H) 63.556 μ s 15.7 kHz Line average data rate .53 bytes/ (40.5-MHz cycle) Vertical active 234.5 H 14.904 ms 89% active Vertical FP 10 H .635 ms Vertical sync 3 H .190 ms Vertical BP 15 H .953 ms Vertical blanking 28 H 2.22 ms Field time 262.5 H 16.683 ms (225, 225; 13.5-MHz clock) 59.94 Hz 72% active Frame time 525 H 33.36 ms (450, 450; 13.5-MHz clock) 29.97 Hz 72% active Image size 324, 548 pixels

[Page 117] The detailed vertical timing for NTSC mode is defined in the following table, with a total of 525 lines numbered from 0 to 524. This format includes more blanked lines than the NTSC specification to avoid problems with overscan in external monitors. NTSC vertical line timing First line Last line Number of lines Function 523 20 23 Blanked lines for NTSC specification 21 23 3 Additional blanked lines 24 258 235 Active lines, even field 259 260 2 Additional blanked lines 261 282 22 Blanked lines for NTSC specification 283 286 4 Additional blanked lines 287 520 234 Active lines, even field 521 522 2 Additional blanked lines The timing for PAL signal generation is shown in the table below. External PAL Parameter Pixel clock cycles Time Pixel clock 1 74.07 ns (13.5 MHz) Line active 688 50.963 μ s 80% active Line FP 34 2.519 μ s Line sync 64 4.74 μ s Line BP 78 5.78 μ s Line blanking 176 13.037 μ s Line time 864 (H) 64 μ s 15.625 kHz Vertical active 282.5 H 18.08 ms 90% active Vertical FP 6 H .384 ms Vertical sync 2.5 H .160 ms Vertical BP 21.5 H 1.376 ms Vertical blanking 30 H 1.92 ms Field time 312.5 H 20 ms (270, 000; 13.5-MHz clock) 50 Hz 72% active Frame time 625 H 20 ms (540, 000; 13.5-MHz clock) 25 Hz 72% active Image size 388, 720 pixels

[Page 118] The detailed vertical timing for PAL mode is defined in the following table, with a total of 625 lines numbered from 0 to 624. This format includes more blanked lines than the PAL specification to avoid problems with overscan in external monitors. PAL vertical line timing First line Last line Number of lines Function 623 21 24 Blanked lines for PAL specification 22 24 3 Additional blanked lines 25 307 283 Active lines, even field 308 309 2 Additional blanked lines 310 334 25 Blanked lines for PAL specification 335 338 4 Additional blanked lines 339 620 282 Active lines, even field 621 622 2 Additional blanked lines VP board functional block diagram

[Page 119] 4.2.4 IQDAS (IP) This board takes IQ (In Phase, Quadrature Phase) data or IM (Image Memory) data output from BE PWB SIP section into capture memory with real time by memory R/W control FPGA. It is possible to store the particular part of taken data into the temporary storage memory. Because of this temporary storage memory, it is possible to continue capturing data without stopping examination finished, several captured data in the temporary storage memory is transferred to the system memory by DMA via PCI bus. (2) Circuit blocks 1) Data-IF section (between BE PWB) 2) Capture memory section 3) Temporary storage memory section 4) DMA Controller section 5) PCI-IF section <Block diagram> BE board PCI64@33MHz CINE 16 bit/Pixel 160 MB/S 256 MB 60MB/S SBC 32@40MHz B/M 12@40MHz DR EP 32 RC SC IQ PCI 64@33MHz 16@40MHz FP Bc/Mc SIP FPGA PWD/CWD 16@40MHz CB 12bit@40MHz Memoory PHYSIO DSP 16 MB x 2 Router IQDAS board IP Data path 64@33MHz Memoory PCI-PCI DIMM 64 x 2 FPGA PMC CPU 64bit@66MH PCI-Local PCI 64bit@33MHz

[Page 120] <<Circuit functions>> Functional Block Major Function Back Plane CNN Connector with APLIO XG main unit PCI-PCI Bridge IP board is connected with Aplio via PCI bus. There is PCI-PCI Bridge on IP board for separate PCI bus inside IP board. PCI-LOCAL Bridge The Interface device between IP board internal PCI bus and Local bus. LOCAL SRAM The working RAM for PCI-Local bridge device. BOOT ROM IP board information is stored in this ROM. DIMM memory for data capture The memory to capture IQ data or IM data in real time 512 MB DIMM memory Temporary data storage memory Temporary data memory; data taken from the above DIMM memory (DIMM) 512 MB DIMM memory DATA INPUT IQ data/IM data input buffer (only Buffer) FPGA Capture memory, Temporary storage memory Read/Write control, DIMM initialization, Refresh function, Interrupt function CONFIG ROM Configuration ROM for FPGA CLOCK DRIVER IP board basic clock generator (33 MHz oscillator) Making 66 MHz from 33 MHz (40 MHz from BE) PWB RESET IP board local reset DIP SW Several hardware settings: Do not change the original settings S10 : for PCI-Local Bridge device IC initial setting S4 : for PMC interrupt S5 : for PCI/PMC (future use) settings S7 : for FPGA settings S9 : for FPGA ROM/SDRAM settings S6 : for PROM_FPGA JTAG settings S2/S3 : for Clock driver settings S1 : board Reset UXS11 : FPGA configuration switch Power supply circuit 3.3 V 2.5 V 5 V

[Page 121] DIP SW default settings SW bit SW No. SW function 1 2 3 4 5 6 7 8 S2 OFF ON ON ON Local CLK = 66 MHz S3 ON ON ON OFF Local PreClk = 50 MHz S4 ON OFF OFF OFF PMC1 Int. = INTA* S5 ON OFF OFF OFF PCI JTAG S6 ON OFF OFF ON Xilinx JTAG PROM+FPGA S7 OFF OFF ON ON OFF OFF OFF OFF FPGA DIMM Mode 512 MB S8 ON OFF OFF OFF PMC2 Int. = INTA* S9 ON ON OFF OFF JTAG Sel PROM+FPGA S10 ON OFF OFF ON Galileo Auto load ON LEDs on the board No. FPGA Operation when lit 06 R/W LED6 (during external transfer) 05 R/W LED5 (during internal transfer) 04 R/W LED4 (during data acquisition) 03 R/W LED3 (during data delivery) 02 R/W LED2 (not used) 01 R/W LED1 (not used) 00 R/W LED0 (occurrence of error)

[Page 122] 64 bit 33 MHz PCI Bus PCI-PCI Bridge PMC Acq Mem DIM (For capture) 512 KB Trans Mem DIM (For storage) 512 KB Local 64 bit 33 MHz PCI Bus Local SRAM IQDAS board function block diagram Config Ration ROM Cont SDRAM Mem Cont FPGA Xilinx XCV 1000E PCI/Local Bridge Boot ROM V V IQ Data IM Data

[Page 123] 4.3 System-Related Boards 4.3.1 I/O The I/O board connects the power, audio, video, and signals between various I/O devices located both inside and outside the system and the BP (BackPlane) board (the USB signal is partially passed through a relay board (UP board)). In addition, the I/O board provides appropriate cable connections using the required shields and decoupling in order to meet EMI, RFI, and ESD requirements. (2) Functions This board has the following functions. (a) Power Power is supplied to the Physio module and external units connected via USB port. (b) Video System monitor output (RGB and DVI outputs) from the BE board, S-Video input/output, RGB output, and C-Video output from the VP board are performed. To output the video signal to the external monitor, set the S3 switch to the PAL/NTSC side when mounting the VP board. S3 Left : SVGA Right: PAL/NTSC

[Page 124] (c) Audio The following signals are output from the BE board. • Audio signal for speaker and external recording/playback device • Microphone audio signal (d) Speaker The system speaker signals processed in the IO board are amplified in the Audio Power amplifier and then output to the system speaker. (e) Communication/control The following interface functions are provided. • USB hub and ports • Front panel (for the user) • Ethernet: 10/100Base-T • Serial ports (COM1, COM2) BE VP Dop NTSC/ NTSC/ Audio Audio PAL in PAL out out cont SVGA MA Line audio in/out IO Board Audio Out Audio In RS232C External Interfaces VCR Out External Signal EMC Control VCR In USB Audio Control/Power Amp RS232C USB 10/100 base T 10/100 base T USB On-Off Switch Audio to SVGA to Footswitch System System Speaker Monitor System Interconnect Segment IO board block diagram

[Page 125] 5. OPERATING PANEL Connection with the main unit is performed using video signals for the TCS (Touch Command Screen), external input/output signals, and control USB signals. The USB-HUB is inside the operating panel. The functions of this panel (touch panel, trackball, full keyboard, and panel switches) are executed independently via this HUB. The operating panel uses +3.3-V, +5-V, and +12-V power supplies. (2) Functions and operation (a) Panel CPU section (USB) • Transmits the information input by various switches (other than the POWER switch) to the main unit. • Transmits information via the rotary encoder. • A/D-converts the rotary VR and STC sliding VR analog data and transfers them as digital data to the main unit. • Transmits the information input by the footswitch to the main unit. • Lights and extinguishes various LEDs by transmitting data from the main unit. • Sounds the buzzer when a switch is pressed by transmitting data from the main unit. (b) Touch panel section (USB connection) • Transmits the information input by the touch keys (switch input coordinates) to the main unit. (c) Keyboard section (USB connection) • Transmits the data input by the keys on the keyboard. (d) Trackball section (USB connection) • Receives the information input by the SET and NEXT switches and wheel switch and transmits them to the main unit. The trackball section also transmits the information input by the trackball to the main unit. Note, however, that lighting of the LED and input/output of the dial (encoder) are controlled by the Panel CPU. (e) LCD section A/D-converts the image signal for the TCS menu from the main unit and displays the TCS menu on the LCD monitor. (f) Input status of the POWER switch and lighting/extinguishing of LEDs (g) Lighting/extinguishing of the STANDBY LED

[Page 126] (3) Additional explanation of terms TCS : Touch Command Screen. This module integrates the touch keyboard with the LCD screen. The 10.4-inch LCD has 640 × 480 pixels. USB hub : There is one USB cable from the main unit. However, it is branched into four ports by the USB hub in the operating panel. (4) Connection diagram Xario main unit (I/O board) Interior of the operating panel USB-HUB (4 ports) Full Trackball Touch panel keyboard LCD control LCD A/D board USB ASSP PANEL CPU Set Power Power SW SW Rotary encoder Buzzer /Next ON SW /Standby LED /Rotary VR /Wheel LED SW : USB signal : Control signal : Image signal

[Page 127] (5) Calibration of the touch panel and setting of paddle switch orientation When the HDD has been replaced, the touch panel must be calibrated (adjustment of touch panel coordinates) and the paddle switch orientation must be set. (The touch panel calibration values and paddle switch orientation settings are stored in the registry in the HDD.) The paddle switch orientation can be changed according to user preference. It is also possible to change the paddle switch drive direction. (a) Touch panel calibration procedure <1> Start up the system in Windows or stop the US software using the STOPZ.JS command etc. to set the system in Windows. Do not perform touch panel calibration while the US software is running. <2> Double-click the executable file below. C:\SetAplio\ControlPanelDriver\V1-R4\ControlPanelDriverV10L10\Calwin.exe <3> A cross mark (+) appears on the TCS. <4> Press the cross mark on the TCS. Each time the mark is pressed, the display position moves as shown below. <1> <2> <3> <4> <5> <6> <7> <8> <9> <5> Press to move the mark to the last position and then press the Enter key of the full keyboard. Calibration is completed and the paddle switch setting screen is displayed.

[Page 128] (b) Paddle switch setting procedure Paddle1 Paddle2 Paddle3 UP DOWN <1> Press the paddle1, paddle2, or paddle3 switches as required to change the switch orientation from vertical to horizontal. Paddle* Paddle* <2> Press the Enter key of the full keyboard to complete the paddle switch setting. <3> Reboot the system to make the new switch settings effective.

[Page 129] (6) Cleaning the panel (a) Cleaning of keytops <1> Remove dirty keytops. Refer to subsection 3.5 "Disassembling the Operating Panel" for the panel disassembly procedure. Refer to (7) of this subsection for the keytop replacement procedure. <2> Clean the removed keytops. <3> After cleaning, reinstall the removed keytops. CAUTION: Use water or mild detergent to clean the keytops. Completely wipe off the water from the keytops before reinstalling them. Do not use chlorine-based cleansers, acids, or organic solvents (such as alcohol). Also, be sure to reinsert the keytops at their original positions with correct orientations. (b) Cleaning procedures for the palm switch <1> Fit the dial unit attaching/detaching tool (service part) into the groove on the top of the dial unit. Rotate the tool counterclockwise to remove the dial unit. <2> Remove the ball from the palm switch. <3> Clean the detection shafts and 45° bearing (shaded sections in figure 3) with a piece of gauze. <4> Clean out the inside of the case using the air spray. Take appropriate measures to prevent dust from flying out. Check for foreign matter inside the case. <5> Clean the gap between the dial and the cover (circumference) using the air spray. <6> Clean the ball and place it back into the palm switch. Fit the cover locking tabs into the slots taking care not to allow the ball to interfere with the cable. <7> Fit the dial unit attaching/detaching tool into the groove on the top of the dial unit. Rotate the tool clockwise to securely mount the dial unit. (Rotate the dial unit attaching/detaching tool until it locks into place with an audible click.) <8> Confirm that there are no abnormalities in ball rotation and dial rotation.

[Page 130] Rotate the dial unit attaching /detaching tool in this direction Dial unit attaching to remove the dial unit. /detaching tool Slot position for releasing the dial unit Slot position for locking the dial unit Rotate the dial unit attaching /detaching tool in this direction to mount the dial unit. Figure 1 Figure 2 Cover locking slots BALL Clean the gap between the dial and the cover using the air spray. Cover locking tabs Detection shafts 45° bearing Figure 3 Figure 4 CAUTION: When removing the top cover of the palm switch, be careful not to damage the cable inside. In addition, be sure to reinstall the palm switch on the panel in the correct orientation. Use water or mild detergent to clean the ball. Completely wipe off the water from the ball before reinstalling it. Do not use chlorine-based cleansers, acids, or organic solvents (such as alcohol). (c) Cleaning procedures for parts other than keytops Use a clean dry cloth for cleaning other parts. If dirt is difficult to remove, use a cloth that has been moistened with water or mild detergent and then tightly wrung out. CAUTION: Do not pour water or mild detergent directly on any parts. Do not use volatile organic solvents such as benzin, paint thinner, or alcohol. Also, do not use rags impregnated with chemicals.

[Page 131] (7) Keytop replacement procedure Insert the tip of the dedicated tool between the panel and the keytop, and lift the keytop using the tool as a lever. The keytop case may get scratched or the tool may be damaged. <2> Remove the keytop using the tool as a lever. <1> Insert the tip of the tool between the panel and the keytop. Remove the Insert the tip of keytop using the the tool. tool as a lever. Remove the Insert the tip of keytop using the the tool. tool as a lever. To remove the keytop of the round switch beside the LCD, tilt the key with a finger to create a gap and insert the tool tip in the gap.

[Page 132] 6. POWER SUPPLY UNIT 6.1 Power Supply Unit Configuration The power supply unit of this system consists of the following five modules. (1) TRANS-UNIT • Isolation transformer (AC isolation transformer) • PSL (inrush current circuit module) • PSI/PSC (power supply unit control section and battery charging section) (2) Battery (rechargeable cell for CPU backup and resumption) (3) PSA-S (power supply for AC/DC converter and analog circuits) (4) PSD-S (power supply for AC/DC converter and digital circuits) (5) PSH (+/ − 100-V power supply for 1.5D transducer) PSH PSA-S PSD-S Trans-unit

[Page 133] 6.2 Block Diagram of the Power Supply Unit The block diagram of the power supply unit of this system is shown below. OEM output System rack Monitor Battery Control PSI/PSC 5 Vsb 8 output Line Filter PSL PSA-S 140 W AC100 V 230 V Isolation Transformer 4 output PSD-S 270 W TRANS-UNIT

[Page 134] 6.3 Unit Specifications (1) Line voltage 100-V system 90 to 132 VAC : 49 to 61 Hz 230-V system 198 to 264 VAC : 49 to 61 Hz (2) Power consumption 1500 VA max (3) Output voltage OEM output Output voltage 1:1 Total 300 VA (when 100 to 120 VAC is input) 380 VA (when 220 to 230 VAC is input) Monitor output 170 VAC Battery charging +8 VDC 1.5 A ACRMVRS +5.0 VDC 0.35 A ACRMMSV +5.0 VDC 1.0 A PSA-S P2.5A +2.575 VDC 6.3 A P3.3AQ +3.45 VDC 23.5 A M3AQ -3.10 VDC 5.6 A P5AQ +5.00 VDC 15.7 A P14AQ +14.2 VDC 0.60 A M14AQ -14.2 VDC 1.10 A Variable control voltage VTX0 +0.125 to 18.0 VDC 20 W VTX1 +0.125 to 18.0 VDC 20 W PSD-S P3.3D +3.45 VDC 32.0 A P5D +5.00 VDC 13.0 A P12D +12.0 VDC 13.0 A M12D -12.0 VDC 2.10 A

[Page 135] 6.4 Outlines of the Modules 6.4.1 TRANS-UNIT • Isolation transformer Input voltage The input voltage can be switched between that for 100-V systems and that for 200-V systems using the internal switch. 100-V systems 90 to 132 VAC : 49 to 61 Hz 200-V systems 198 to 264 VAC : 49 to 61 Hz Power consumption 960 VA (max) Isolation Between primary and secondary : 4000 V * Caution: Voltage setting after the power supply unit has been replaced The power supply unit is provided with a switch to selecting the output voltage according to the input voltage. If the switch setting is incorrect, the system power may not turned ON normally or peripheral units may be damaged. Be sure to check the setting of the voltage selection switch after the power supply unit has been replaced. 100 to 120 VAC S1 and S2 should be set so that indicator shows "115". 220 to 230 VAC S1 and S2 should be set so that indicator shows "230". • PSL (inrush current limiting circuit) (1) Inrush current prevention circuit A circuit for preventing inrush current when the power breaker is turned ON is installed.

[Page 136] • PSI/PSC (power supply unit control circuit, output interface) (1) Power ON/OFF sequence control The power ON/OFF sequence is controlled. (2) Protective control against power supply abnormalities Protective control against abnormalities of the power supply unit, such as overvoltage and overcurrent, is performed. (3) Battery charging circuit Battery charging is controlled. (4) Output interface The PSC module is provided with a connector to output power to the system and outputs AC power for the PSA-S and peripheral units. The ratio of the AC output voltage for the peripheral units to the system AC input voltage is 1:1. The isolation AC output capacity is designed to be 420 VA, but it is limited according to the power consumption of the overall system. • Power supply for air-cooling fans Power for the system cooling fans is output. 6.4.2 Battery (1) Secondary charging cell The battery module is provided with a charging cell circuit for resumption and for backup of the system CPU. This battery uses a secondary cell (consumable part).

[Page 137] 6.4.3 PSA-S This power supply module for analog circuits supplies power to the circuits in the transmission/reception front-end unit. The AC input from the isolation transformer is converted into DC and then supplied to the system circuit board. (1) Input 100 VAC output from the isolation transformer (90 V to 132 V) (2) Fixed voltage outputs P2.5A, P3.3AQ, M3.3AQ, P5AQ, P14AQ, M14AQ (3) Variable output VTX0: Ultrasound pulse transmission power supply 0 VTX1: Ultrasound pulse transmission power supply 1 6.4.4 PSD-S This power supply module for digital circuits supplies power mainly to the BE unit. The AC input from the AC inlet is input to this module via the PSL, converted to DC, and then supplied to the system circuit board. (1) Input Part of the AC power output from the PSL is branched to this module (90 VAC to 264 VAC) (2) Fixed voltage outputs P3.3D, P5D, P12D, M12D (3) Variable output None

[Page 138] 6.5 Description of Each Connector TRANS-UNIT (1) OEM AC output The OEM AC output consists of the two systems; one is output when the system breaker is turned ON (UNSWITCHED: output No. 4), and the other is output when the relay in the PSL is turned ON by the relay control signal from the PSC at the time of system power ON (SWITCHED: outputs No. 1 to No. 3). • OEM OUTLET Peripheral unit connection section Output No. 4 Output No. 3 Output No. 2 Output No. 1 Output capacity (total for the 4 receptacles) : 300 VA (when 100 VAC to 120 VAC is input) 380 VA (when 200 VAC to 230 VAC is input) (2) Fan output J914 PWB rack fan J980 PSA-S fan J981 OEM fan J998 TRANS-UNIT fan (3) PSA-S J969 AC output for PSA-S (also suitable for PSH) J961 PSA-S control

[Page 139] (4) PSD-S J974 AC output for PSD-S J962 PSD-S control J966 (5) PSH J969 AC output for PSH (also suitable for PSA-S) J975 PSH control (also suitable for the battery) (6) Battery pack J975 Battery output and control (also suitable for PSH) (7) AC output for the monitor (J910) Pin 1 Pin 4 PIN No. Signal 1 150 VAC to 190 VAC 2 150 VAC to 190 VAC 3 FG 4 NC (8) Other outputs • PSA-S outputs (J903, TB1, TB2) • PSD-S (J102), Power output for the panel (J911), CDR (J997) • PSI/PSC outputs: Control signal input/output (J902) • PSH (J403)

[Page 140] 6.6 Operational Checks (1) Precautions for the operational checks Perform the operational checks paying attention to the following points. • Do not touch the input line. An electric shock may result. • Do not touch the output connectors during operation. An electric shock may result. • Be careful when handling parts that may have a residual charge even after the power supply is turned OFF. An electric shock may result. (The residual charge in the output capacitors cannot be discharged immediately.) • Do not disassemble units such as the PSA-S/PSD-S box by removing the cover etc. (The PSA-S/PSD-S should be replaced as a unit.) (2) Test point locations for PSA-S/PSD-S PSA-S Test points are provided on the sides of the power supply unit. GND P2.5A M3AQ P5AQ P3AQ P14AQ M14AQ VTX0 VTX1 The voltage between each output test point and the GND test point can be checked using the tester. When the module is mounted on the system Output name [rating +/- (5% + total fluctuation)] P2.5A +2.45 to +2.70 V M3AQ -2.95 to -3.25 V P5AQ +4.75 to +5.25 V P3AQ +3.28 to +3.62 V P14AQ +13.4 to +14.8 V M14AQ -13.4 to -14.8 V VTX0 Confirm that they change according to the AOP setting. VTX1

[Page 141] PSD-S The PSD-S module is a multipurpose power supply and therefore is not provided with test points. Instead, an LED that indicates the operation status is provided for each output. When the operation is normal, the LED is lit. The output voltage can be checked using the following method. Voltage check on connector P102 Voltage test pin Voltage reference pin Voltage (V) 1, 2, 13, 14 4 3.45 ± 5% 3, 15 20 3.45 ± 5% 6, 7, 8 18 5.0 ± 5% 9, 10, 11 21 12.0 ± 5% 12 24 -12.0 ± 5% Pin assignment of P102 12 11 10 9 8 7 6 5 4 3 2 1 24 23 22 21 20 19 18 17 16 15 14 13 6.7 LEDs for Error Display The power supply unit is provided with a 7-segment LED that indicates the unit status. For the procedure for identifying faults in the power system, refer to the service manual (maintenance volume). Indication on 7-segment LED Fault 1 Input voltage abnormality 4 Overvoltage or abnormal temperature in No indication is PSA-S displayed by the LEDs if an 6 Overcurrent or voltage drop in PSD-S abnormality occurs 7 Air-cooling fan abnormality (PSD-S) at the time of startup. 8 Air-cooling fan abnormality (system)

[Page 142] 7. LCD MONITOR (1) Specification Line voltage : 90 V to 264 V Power consumption : 60 W or less Monitor size : 19-inch Dot pitch : 0.294 mm × 0.294 mm Input signal : DVI-digital Maximum resolution : 1280 × 1024 pixels, 60 Hz/75 Hz Mass : Approximately 6 kg (2) Adjustment menu (a) User mode The menu switches on the front of the LCD monitor are used to display the user menu and to select menu items. The [ − ] switch and [+] switch are used to select the brightness, contrast, screen size, and γ curve. User menu Menu item Default value Adjustment range Brightness 30% 0% to 100% Contrast 100% 0% to 100% Size 2 1/2/3 γ 2 1/2/3/4 * To reset the setting to the default value, press the [+] switch while holding down the [ − ] switch.

[Page 143] (b) Service mode 1) Opening and closing the service mode menu Hold down both the [ ▼ ] switch and the [+] switch on the front of the LCD monitor for 3 seconds to display the service mode menu (main menu). To close the service mode menu, select the exit key and press the [ ▼ ] switch. Exit key Menu switches [-] switch [+] switch 2) Menu operation Use the [+] and [ − ] switches for menu operation. Press the [+] or [ − ] switch to move the selection cursor to the desired function and then press the [ ▼ ] switch to set the selection. The submenu for the selected function is displayed to show more detailed functions. Use [+] or [ − ] to select the desired function and then press [ ▼ ]. The adjustment menu with an icon is displayed. Change the value using [+] or [ − ] and then press [ ▼ ] to set the new value. MENU [ ] Use [+] or [-] to change the value. MENU [ ]

[Page 144] 3) List of functions available in the service mode menu Menu list Main menu Function Sub-function Default value Adjustment range Screen Smoothing 3 1 to 5 Return — — Color Brightness Brightness 40% 0% to 100% Contrast 100% 0% to 100% Temperature 1 1, 2, Off Gamma 2 1/2/3/4/Fixed Saturation 0 -100 to 100 Hue 0 -100 to 100 Gain Red —% 0% to 100% Green —% 0% to 100% Blue —% 0% to 100% Reset — — Return — — Other Screen Size 2 1/2/3 Border Intensity Black (0) Black (0) to white (255) Menu Position Bottom left Top left to bottom right Menu Off Timer 5 sec 5/10/25/50 sec Reset — — Return — — Information Information (1/2) — — Information (2/2) — — Language English English/German/French/ Spanish/Italian/Swedish/ Japanese Exit — — CAUTION: Be sure to quit service mode after the service mode menu is used. Otherwise, automatic power save mode is not started.

[Page 145] 4) Details of the functions in the service mode menu • Screen Smoothing : Used to adjust the smoothness of the characters and lines in the image. (5 steps, soft to sharp) • Color Brightness : Used to adjust the screen brightness. (0% to 100%) Contrast : Used to adjust the image contrast. (0% to 100%) Temperature : Used to select the color temperature. (1, 2, Off) Color temperature 1 is higher than 2. * The value is set to OFF automatically when the gain value is changed. Gamma : Used to set the γ value. (1, 2, 3, 4, Fixed) Saturation : Used to adjust the saturation (vividness of colors). (-100 to 100) * The entire color scale may not be displayed when this function is used. Hue : Used to adjust the hue (coloring). (-100 to 100) * The entire color scale may not be displayed when this function is used. Gain : Used to adjust red, green, and blue individually to obtain the desired color. (0% to 100%) * Gain adjustment is disabled when the Temperature value is changed. Reset : Used to reset all color settings to the default values. • Other Screen Size : Used to change the image display size. (1, 2, 3) 1: 19 inches (full-size) 2: 17 inches 3: 15 inches (equivalent to the display size of the 17-inch CRT monitor) Border Intensity : Used to adjust the brightness of the borders (areas where no image is displayed). (0 (black) to 255 (white)) Menu Position : Used to adjust the menu display position. (Any position on the screen) Use the [+] or [ − ] switch to adjust the position. The adjustment direction (horizontal or vertical) can be selected using the [ ▲ ] switch. Menu Off Timer : Used to adjust the time for which the menu is displayed. (5 s, 10 s, 25 s, 50 s) Reset : Used to reset all settings to the default values.

[Page 146] • Information Information (1/2) : Displays the currently selected input signal, resolution, horizontal frequency, and vertical frequency. Information (2/2) : Displays the serial number, hours of use, and firmware version of the LCD monitor. • Language Language : Used to select the language for menus. (c) Power save mode 1) Forced power save mode Hold down both the [ ▲ ] switch and the [ − ] switch for approximately 1 second to forcibly set the monitor to power save mode (backlight off). To cancel power save mode, hold down both the [ ▲ ] switch and the [ − ] switch for approximately 3 seconds. Forced power save mode remains set after the power switch on the operating panel is turned OFF unless it is canceled as described above. 2) Automatic power save mode The monitor is set to power save mode (backlight off) automatically when no signal is input for 5 seconds or more. (3) Status LED The LED at the lower front of the LCD monitor indicates the monitor status. LED indication Status OFF AC power OFF Blinking green (ON/OFF at 2-s intervals) Forced power save mode Lights green Startup, display ON Lights orange Automatic power save mode (No signal) Blinking orange (ON/OFF at 2-s intervals) Signal error Blinking orange (ON/OFF at 1-s intervals) Automatic power save mode (Abnormal temperature inside the LCD monitor)

[Page 147] 8. PHYSIO MODULE This module detects physiological signals (ECG, respiration, PCG, and pulse) using the ECG cable and sensors and transfers the data to the diagnostic ultrasound system (hereinafter referred to as "system"). Line voltage ECG (electrocardiogram) 1CH (IM RESP (respiration) 1CH) DC IN (external input/ECG) 1CH (line voltage: ± 2.5 V) PCG (phonocardiogram) 1CH Pulse (pulse) 1CH AUX (external input) 1CH (line voltage: ± 2.5 V) (2) Functions The following functions are provided. (a) Amplification of the electronic potential induced by the R and F electrodes of the ECG cable attached on the body surface and transfer of the data to the system in order to display the ECG on the monitor. Detection of the QRS waveforms and transfer of the signals to the system. Measurement of the electrical resistance in the chest with an alternating current (between electrodes R and F) and transfer of the data to the system in order to monitor the respiration cycle. (b) Transfer of data from the PCG sensor attached to the chest to the system in order to display PCG waveforms on the monitor. (c) Transfer of data from the waveform sensor attached to the carotid artery and apex of the heart to the system in order to display pulse waveforms on the monitor. (d) Transfer of input signals (physiological signals) from two external medical devices to the system. The input signal from the one of the external medical devices can be output to the system as a trigger signal for imaging. (3) Operations This module consists of the amplifier section, power supply section, and digital section. The module is connected to the system via a cable and a 15-pin D-sub connector. The module receives a 12-V power supply and waveform request command from the system and performs waveform (such as ECG and PCG) output to the system. The amplifier which amplifies the ECG, respiration, PCG, pulse, and external device signals is set inside this module. After importing the A/D values, the module calculates the sensitivity and position using the single-chip CPU inside the A/D converter and stores them in the RAM as digital values. QRS detection is performed by the hardware. The waveform data is output via a serial interface at a transmission rate of 312.5 Kbaud when a waveform request command is received from the system. QRS detection signals are output by setting QRS flags in the detection signals and waveform data (two series). Also, sensor connector insertion/removal information is transferred to the system. For the ECG connector, lead ON/OFF information, which indicates whether or not the three electrodes are attached to the patient properly, is output.

[Page 148] 15-pin D-sub QRS detection circuits A circuits A,B select switch RS-422 driver/ receiver QRS detection power source QRS ECG RESP (impedance) RESP (thermistor) PCG PULSE AUX2(AUX) RS-422 driver/ receiver detection circuits B RAM FLASH ROM R-wave detection gain control QRS detection circuit control Test signal control ON/OFF QRS detection gain MPU A/D control AUX2 (AUX) gain PULSE gain control ECG switch control AUX2 (AUX) gain PULSEgain PCG gain control PCG gain AUX2 (AUX) time constant control ECG test signal sw PULSE time constant control AUX2 (AUX) AMP PCG AMP PULSE AMP signal Respiration select switch PCG filter circuits ECG test control 13 bits PULSE x1/x10 ontrol AUX2 (AUX) AUX2 (AUX) PULSE circuits x1/x10 control PCG filter lead detect signal ECG switch lead detect signal PULSE AUX2 signal circuits signal PCG test signal (AUX) test AUX1/ECG (DC IN/ECG) PCG test circuits lead detect signal AUX1/ECG (DC IN/ECG) PCG PULSE lead detect signal AUX2 (AUX) PWM demodulator PWM demodulator AUX2 (PCG) PULSE (AUX) ECG lead detect signal AUX1/ECG (DC IN/ECG) PHONO Photo coupler Floating power source Photocoupler Photocoupler Osillator for PWM PWM modulator PWM modulator AC line filter (impedance ECG circuits ECG lead detect circuits RESP circuits method) osillator and demodulator RESP (impedance) test signal ECG

[Page 149] 9. CONNECTION DRAWING FOR UNITS No.49, 50 Option GelWarmer AC Plug P910 Monitor No.2 OEM outlet 115/230 V selectable J998 J981 J900 AC IN J915 Front OEM Cooling Fan No.3 7-Segment LED Mecha. 4D Transducer Pencil Transducer J969 (AC, 2nd.) TRANS UNIT No.1 J975 (AC, 2nd.) : Male connector : Female connector No.13 J980 J914 No.6 No.16 No.15 J974 PSA Cooling Fan Battery Pack J962 CONT. No.17 No.4 No.7 Note: PSA J953 J961 CONT. AC IN PSD PJ2 PJ1 J971 J995 12 V.IN PSHP PSHN TB1-3 TB1-4 TB1-1 TB1-2 TB2-1 TB2-2 TB2-3 J903 J958 J902 J972 J966 Fail and 3.3 V, 5.0 V: RC Slot Header No.31 No.5 SYSTEM Cooling Fan J911 (3.3 V/5 V/12 V) No.11 No.10 No.9 No.18 No.12 No.14 J997 (12 V/5 V) Probe Panel No.8 J815 J103-7, 8 J103-1, 2 J103-3, 4 J103-9, 10 J103-11, 12 J103-13, 14 J203 DC IN DATA HDD No.41 J403 (±100 V) J103-5, 6 (3.3 V) J202 PS CONT AC IN J102 PSD POWER J601 TI Board No.27 DATA IN No.26 C_Printer J15 No.25 J31A USB J30A USB No.38 J801 J31B USB J32A USB USB Pin Header No.19 J29 LAN J32B USB No.29 FOOTSW PANEL J33A USB No.37 J30B USB J6 USB J5 USB J33B USB CPU Board BP Board J303 FOOT SW 2 J4 USB LAN DC IN AC IN No.28 FOOT SW 1 J3 USB J2 USB DATA CDR (DVDconv) B/W_Printer DATA IN J1 USB J18 USB No.39 No.20 No.40 PHYSIO J27 USB No.23 J10 Physio No.24 Physio Module J9 Paner RGB CPV No.30 J11 COM 1 AC IN R L IN IO Board J50 USB USB J2 Paner No.22 CP REMOTE 232C R L OUT Control panel LOUT ROUT J29 Speaker J8 Y/C IN DC IN J932 LIN RIN J12 COM2 Y/C OUT J7 Y/C OUT J13 USB User area J1 System Monitor Y/C IN AC IN VCR No.36 J16 USB No.21 J16 USB J28 USB J21 Y/C OUT J20 C Video OUT J25 USB J19 Ethernet SM Color Monitor J17 VSR DVI-D J22 Ext RGB OUT No.44 No.45 No.42 No.43 AC IN No.46, 47, 48 MO DATA/DC IN 3D No.34 No.33 No.32 No.35 SP/R SP/L J73 USB J72 USB RP J75 Y/C OUT J74 C Video OUT J71 Ethernet

[Page 150] No. Drawing number for SSA-790A Connection points 1 CM30-35353 PSA-S cooling fan cable 2 CM30-35483 Front OEM cooling fan cable 3 CM30-35354 Front OEM cooling fan connection cable 4 CM30-35683 PSA-S DC power cable 5 CM30-35462 PSA-S control cable 6 CM30-35453 PSD DC power cable 7 CM30-35463 PSD control cable 8 CM30-35680 PSD output cable 9 CM30-35455 PSA-S output cable 10 CM30-33022 PSA-S DC power cable (VTX) 11 CM30-35456 PSA-S DC power cable (P3.3AQ) 12 CM30-35457 PSA-S DC power cable (P5AQ) 13 CM30-35684 HV power cable 14 CM30-35399 HV DC cable 15 CM30-35661 PSH control output cable 16 CM30-35662 PSH control cable 17 CM30-35344 System cooling fan cable 18 CM30-35454 PSI control cable 19 CM30-35346 Monitor AC power cable 20 CM30-35461 Panel power cable 21 CM30-35348 Monitor cable 22 CM30-35484 Control panel IO power D-sub cable 23 CM30-35489 Control panel IO RGB cable 24 CM30-35351 Control panel IO USB data cable 25 CM30-35471 HDD data cable 26 CM30-35472 HDD power cable 27 CM30-35476 DVD power cable 28 CM30-35624 DVD signal cable 29 CM30-35474 Footswitch cable 30 CM30-35357 PHYSIO to IO cable 31 CM30-35480 Mecha 4D transducer/pencil transducer cable 32 CM30-35359 IO rear panel cable 33 CM30-35498 Header USB cable 34 CM30-35499 Y/C cable for connecting the SVHS VCR 35 CM30-35497 Ethernet cable 36 CM30-35398 Speaker cable 37 CM30-32988 MA_LAN cable 38 CM30-35289 USB cable for header 39 CM30-35356 USB hookup cable 40 CM30-33062 B&W printer data cable (USB-USB) 41 CM30-33063 Color printer data cable (USB-USB) 42 CM30-33052 Audio IO to VCR cable 43 CM30-33053 Audio VCR to IO cable 44 CM30-33054 Y/C OUT: IO to VCR IN cable 45 CM30-33055 Y/C playback: VCR OUT to IO cable 46 CM30-33058 VCR remote control: Panasonic: RS232C correspondence cable 47 CM30-33076 VCR remote control: Mitsubishi: RS232C correspondence cable 48 CM30-33081 VCR remote control: Sony: RS232C correspondence cable 49 BSM31-2587 AC power cable (100 V) 50 BSM31-2588 AC power cable (200 V)

[Page 151] 10. SOFTWARE ORGANIZATION 10.1 Overall Folder Configuration C: WINNT etc. Windows2000 standard folders Zdt Zdt installation destination Maintenance, including defragmentation of the C drive etc., is important. D: aplio Destination for AplioXG system/application software aplio\bin Destination for executable binary files such as dll, ocx, and exe files aplio\config Configuration at the time of shipment and destination for activated options aplio\user\(toshiba) Destination for files defined by the user aplio\TUSService Destination for the service software The InnerVision contract file is located in aplio\TUSService\IVLicence. The service contract file is located in aplio\TUSService\ServiceLicence. aplio\TUSLog Destination for log file for application software database Database E: Image Destination for actual image files PIMS PIMS work area F: (MO drive) (The MO drive is a service tool.) Destination for the image file Destination for the servicing results G: (DVD drive) Destination for the image file Destination for the servicing results P: (The USB-HDD is a service tool.) Destination for the servicing results T: Temporary drive for DDGW processing Windows file cache U: DVD/CD cache V: DVD cache <unused> W: Work area for DVD/CD writing

[Page 152] 10.2 Version Information The AplioXG software version and the service software version are always displayed on the upper right of the service screen as shown below. For details, refer to the service manual (maintenance volume).

[Page 153] 10.3 Error Handling 10.3.1 Error log operation Error log operation (error registration) is performed in the background as required. The recording destination is the same as for the application log of Windows. The data is located in C:\WINNT\system32\config\AppEvent.Evt. The logged information can be checked using the log display function in the service menu (service menu main screen → Log). The user is notified of 5 types of errors as explained in subsection 10.3.4 "Error log operation (facility)". The errors are registered and error messages are displayed in the dialog box or status bar.

[Page 154] 10.3.2 Error messages Each error message consists of the elements shown in table below. Item Contents Symbol Symbol name to be referred to from applications Severity Importance of error MessageText Simple description of error (title) Facility Error log and operation Explanation Detailed description of error. Referred to from the Syngo error viewer. Action Corrective action for error. Referred to from the Syngo error viewer. Information Additional information. Referred to from the Syngo error viewer 10.3.3 Error levels (severity) There are four error levels (same as Windows Native errors). Severity Meaning Error (STATUS_SEVIRITY_ERROR) An unrecoverable error has occurred. Warning (STATUS_SEVIRITY_WARNING) A recoverable error has occurred. Information (STATUS_SEVIRITY_INFORMATION) Processing has been completed. However, there is additional information. Success (STATUS_SEVIRITY_SUCCESS) Processing has been completed.

[Page 155] 10.3.4 Error log operation (facility) Target to be Facility Operation notified FACILITY_MESSAGEBOX_DANGER Service engineer After an error message is and user displayed in the danger message box, the contents of the error are registered in the log. FACILITY_MESSAGEBOX_WARNING Service engineer After an error message is and user displayed in the warning message box, the contents of the error are registered in the log. FACILITY_MESSAGEBOX_CAUTION Service engineer After an error message is and user displayed in the caution message box, the contents of the error are registered in the log. FACILITY_MESSAGEBOX_NORMAL Service engineer After a message is displayed in the and user message box, the contents of the error are registered in the log. FACILITY_STATUSBAR Service engineer After a message is displayed in the and user status bar, the contents of the error are registered in the log. FACILITY_RELEVANT Service engineer The contents of the error are registered in the log. FACILITY_CSA Engineer --

[Page 156] 11. SETTING THE PRESET MENU 11.1 Outline of Each Preset (1) Basic preset architecture This system contains the following presets. • System Preset • Exam Type (This is actually a system preset. However, it is important and is therefore included here also.) • Application Preset • Imaging Preset • 3D Preset (2) System preset System Preset includes a group of parameters to be set in the system. Some of the parameters included in System Preset are available only to the service engineer, but the parameters are generally available to the user. The user can change the parameters using the system preset editor. (3) Exam Type (a system preset) Exam Type is used to set the transducer, imaging preset, and application preset automatically. In this system, the Exam Type can be completely matched with the imaging preset name. When the Exam Type is selected on the Patient Information screen and the examination is started, the selected Exam Type is registered in the DICOM format. Using the Editor screen, the item (transducer, imaging preset, or application preset) to be activated when Exam Type is selected on the Patient Information screen can be set. (4) Application preset The application preset includes parameters such as Measurement, Body Mark, Annotation, and Report that are available to the user. The user can change the settings using the application preset editor. The application preset values at the time of shipment can be returned to those at the time of shipment at any time even if the values have been changed. Note, however, that if the values are returned to those at the time of shipment, the settings specified by the user are deleted. In order to prevent this information from being deleted, save it to external storage media.

[Page 157] (5) Imaging preset The imaging preset includes a group of parameters related to imaging. They are available to the user. However, there is no preset editor. User setting can be performed using the Save function after selecting the imaging parameter. Up to seven imaging presets can be registered for each Exam Type by the user and can be deleted and overwritten. Note, however, that the factory setting that is contained in each Exam Type cannot be deleted or overwritten. Imaging parameters can be preset independently for Fund., THI, CHI, Color, Power, etc. The 2D-IP is equivalent to B-IP in the previous system. There are five IP Types (A to E) and eight IP Indexes (1 to 8). Parameters such as the dynamic range value in 2D-IP are stored separately (in a separate file) from the imaging preset parameters. (6) 3D preset The 3D Preset consists of the following three presets. Although these presets have been set at the factory, they can be changed by the user. These presets can be set for each Exam Type and each Volume Type. • Initial display preset • Operation preset • Reconstruction preset

[Page 158] A B C D E 2D-IP System Preset (User) System Preset (Factory) (User) ... Annotation Factory Def. (User) (User) Measure ... Body Mark Annotation MSK . Factory Def. (User) Measure Body Mark Abdomen1 Image Preset 8 (User Figure 11-1 Preset structure ... Image Preset 8 (User8) Image Preset 1 (User1) ... Image Preset 1 (User1) Image Preset (Factory) Testes . Probe Info. Image Preset (Factory) Abdomen

[Page 159] Exam Type Imaging Preset Sub-mode CDI Parameters Adult Heart Factory Setting CDI Mode Filter : High Scale: High MAP : V/T1 Power Mode Filter : High Scale: High MAP : P1 TDI Mode User1 OB Factory Setting CDI Mode Filter: High . . . . . . . . (Note that the CDI parameters are only examples and not recommended values.) Figure 11-2 Imaging preset structure

[Page 160] 11.2 Setting and Changing Presets (1) Preset selection on the Patient Information screen Exam Type Adult Heart The user selects an Exam Type on the Patient Information screen. Usually, the Exam Type used for the previous patient is displayed initially on the Patient Information screen. However, if an Exam Type has been saved using Application Preset Editor, the saved Exam Type is displayed as the default. If the displayed Exam Type is acceptable, click the [CONFIRM Start] button. To change the displayed Exam Type, select the desired Exam Type from the drop-down menu and click the [CONFIRM Start] button. The transducer, imaging preset, and application preset are set automatically according to the selected Exam Type. Note that the Exam Type selected on the Patient Information screen is also set as the DICOM Exam Type.

[Page 161] • Exam Type Preset Setting When an Exam Type is selected, the corresponding Transducer, Imaging Preset, and Application Preset are set automatically. No. Exam type Imaging preset Application preset. (Generally used) 1 Abdomen PVT-375BT Abdomen Abdomen1 2 Carotid PLT-704AT Carotid Carotid1 3 Thyroid PLT-805AT Thyroid Thyroid 4 Breast PLT-805AT Breast Breast 5 OB PVT-375BT OB OB 6 GYN PVT-375BT GYN OB 7 Endo-Vaginal PVT-661VT Endo-Vaginal OB 8 Fetal Heart PVT-375BT Fetal Heart OB 9 Adult Heart PST-30BT Adult Heart Adult Heart1 10 Pediatric Heart PST-50AT Pediatric Heart Pediatric Heart 11 Coronary PST-50AT Coronary Adult Heart1 12 TCD PST-20CT TCD TCD 13 Neo-Head PST-65AT Neo-Head TCD 14 Neo-General PVT-375BT Neo-General Abdomen1 15 Neo-Hip PLT-704AT Neo-Hip Neo-Hip 16 PV Venous PLT-704AT PV Venous PV Upper 17 PV Arterial PLT-704AT PV Arterial PV Lower 18 Digits PLT-1204AT Digits PV Upper 19 MSK PLT-1204AT MSK MSK 20 Prostate PVT-661VT Prostate Prostate 21 Kidney PVT-375BT Kidney Abdomen1 22 Testes PLT-704AT Testes Testes 23 OTHER PVT-375BT Other Abdominal 24 M-TEE PET-510MA M-TEE Adult Heart1 Note: This table may be modified in the future without prior notice.

[Page 162] The meaning of each Exam Type (24 total) is given below for reference. 1) Abdomen General abdomen 2) Carotid Carotid artery 3) Thyroid Thyroid gland 4) Breast Mammary gland 5) OB Obstetrics 6) GYN Gynecology 7) Endo-vaginal Endovaginal 8) Fetal Heart Fetal circulatory system 9) Adult Heart General circulatory system 10) Pediatric Heart Pediatric circulatory system 11) Coronary Coronary 12) TCD Transcranial region 13) Neo-Head Neonatal head 14) Neo-General General neonatal abdomen 15) Neo-Hip Neonatal hip 16) PV-Venous PV vein 17) PV-Arterial PV artery 18) Digits Peripheral vessels (fingers) 19) MSK Orthopedics 20) Prostate Prostate 21) Kidney Kidney 22) Testes Testes 23) OTHER Other 24) M-TEE Transesophageal

[Page 163] • Application Preset Setting The measurements, body marks, and annotations that can be selected in each application preset are given below. Default Application Default Body. No. Applicable region Annotation Anno. Body Mark Meas. Preset Menu Menu 1 Abdomen1 Abdomen Abdomen Abdomen1 General Abdomen Abdomen (for Japan) 2 Abdomen2 Abdomen Abdomen Abdomen1 General Abdomen Abdomen (for overseas) 3 Adult Heart1 Adult heart Cardiac Heart Cardiac Cardiac Cardiac 4 Adult Heart2 Adult heart Cardiac Heart Cardiac Cardiac Cardiac 5 Carotid Cerebral blood Vascular Carotid Other Carotid (*2) vessels 6 TCD Transcranial (*1)default – Other Head (*2) Doppler 7 PV Upper Peripheral blood (*1)default – Orthop Shoulder/Arms (*2) vessels (upper) 8 PV Lower Peripheral blood (*1)default – Orthop Body/Legs (*2) vessels (lower) 9 Thyroid Thyroid Small Parts Thyroid Other Neck/Mammo (*2) 10 Breast Chest Small Parts Breast Other Neck/Mammo (*2) 11 Testes Testes (*1)default – Urology Testes/Prostate (*2) 12 OB/Gyn1 Obstetrics OB/Gyn OB OB/Gyn OB OB/Gyn /gynecology 13 Prostate Prostate (*1)default – Urology Testes/Prostate (*2) 14 Pelvis Pelvis (*1)default – Orthop Body/Legs (*2) 15 Penile Penis (*1)default – Urology Testes/Prostate (*2) 16 Pediatric Pediatrics (heart) Cardiac P-Heart Cardiac Cardiac (*2) Heart 17 Neo-Hip Pediatrics (*1)default – Orthop Body/Legs (*2) (orthopedics) 18 MSK Musculoskeletal (*1)default – Orthop Shoulder/Arms (*2) system 19 CHI Contrast medium CHI CHI CHI Abdomen TIC Note: This table may be modified in the future without prior notice. (*1): Only the arrow annotation is displayed on the touch panel. (*2): No measurement items are displayed on the touch panel.

[Page 164] (2) Changing the imaging preset or application preset during an examination To change the imaging preset or application preset after clicking the [Start] button on the Patient Information screen, press the [Preset] switch on the touch panel, select the Imaging Preset page or Application Preset page by pressing the corresponding tab, and select the desired preset. • When the imaging preset is changed A dialog is displayed. The application preset and the transducer are not affected by the change of the imaging preset. • When the application preset is changed No dialog is displayed. The preset is changed directly. The imaging preset and the transducer are not affected by the change of the application preset. * If previous patient information is loaded on the Patient Information screen and the Exam Type is changed before the [Start] button is clicked, the imaging preset, application preset, and transducer setting are changed together accordingly.

[Page 165] 11.3 Preset Editors The system preset and application preset editors are described in this subsection. (There is no imaging preset editor because saving is performed on the touch panel.) (1) System Preset editor (not applicable to Exam Type) The system preset editor is opened by clicking "System Setting" in the popup menu. The submenu shown below is displayed on the monitor. Select an item in this submenu to open the editor. <<Popup menu>>

[Page 166] <<Example of the System Preset editor: "General Setting">> • Functions and locations of the Save and Quit buttons (Common to all the pages of the System Preset Editor) Save : Saves the current settings. No confirmation message is displayed. To enable all of the settings, restart the system (restarting is not required for some setting items, however be sure to restart the system). Quit : Closes the editor screen. • Addition of preset items for service engineers (Common to all the pages of the System Preset Editor) When the service key ([Shift] + [<]) is pressed with the System Preset Editor screen displayed, the preset items for service engineers are displayed additionally. The preset items for service engineers disappear when the Editor screen is closed by pressing [Quit]. To display the preset items for service engineers on a different page of the System Preset Editor, press the service key ([Shift] + [<]) again.

[Page 167] (2) Exam Type editor The Exam Type editor starts up when the Exam Type button in the popup menu is clicked. The following screen is displayed on the monitor. Exam Type Edit Exam Type Adult Heart Save Saves the items currently Imaging Preset <Factory> selected in the Exam Type Application Preset Application Preset p Adult Heart 1 area so that they will be Probe PST-30BT displayed as the default. Application Preset Editor Meas. Window Basic Measment Window Vertical line DisplayOn Transparent Mode Transparent Realtime Display Current All Application Measment Window pp Vertical line DisplayOn Transparent Mode Transparent Realtime Display Current All Font Type Num_14 Num_15 13-Bold Resets the parameters Highlight On Off Saves the parameters for the currently selected currently displayed in item to the factory settings. Factory Setting Save the Application Preset Resets all the parameter Factory Setting Save Quit Editor area. settings in the Exam Type Edit screen to the factory settings. Saves all the parameters for the item selected for Application Preset. At the time of shipment, each Exam type has only one Factory Setting. (The user can create presets.) Select the imaging preset, application preset, and transducer that correspond to the selected Exam Type and click [Save] at the right of the Exam Type field to set them. Exam Type : Can be selected from the items set at the time of shipment. Imaging Preset : The imaging preset related to the Exam Type can be selected. Presets defined by the user are also displayed here. If the Exam Type is changed, the imaging preset is also changed correspondingly. Application Preset: Can be selected from the list of all application presets. If the Exam Type is changed, the application preset is also changed accordingly. Probe : Can be selected from all transducers. If the Exam Type is changed, the setting for Probe is also changed correspondingly.

[Page 168] (3) Application Preset editor This editor is started up in the same manner as the Exam Type editor in (2). Refer to the figure. To edit an application preset, select the desired application preset and also select the item group such as 2D-Meas. etc. Then set the parameters. Depending on the application preset, some item groups are not displayed (for example, OB Calc is displayed only when the OB application preset is selected). [Save] (located in the middle) : Saves the parameters for each item group. [Save] (located at the bottom) : Saves all of the parameters for all item groups (in particular, all of the parameters for the application presets) at one time. [Factory Setting] (located at the second position from the bottom) : Returns the parameter settings to those at the time of shipment. [Factory Setting] (located at the bottom) : Returns the parameter settings for all item groups to those at the time of shipment.

[Page 169] 11.4 Description of Preset Parameters The menu shown below is displayed in the popup menu. Example screens of each editor are shown.

[Page 170] (1) General settings (System Preset) Organization Name The name set here is displayed in the ID area. The user can add items. Remove Used to delete an organization name from the list. System Location The hospital address etc. is entered here. (This is used in the maintenance menu.) Date The date is entered here. Time The time is entered here. Height The unit used for the patient height on the Patient Information screen is set here. Weight The unit used for the patient weight on the Patient Information screen is set here. Data Format The format for the date displayed in the ID area is set here. Time Format The format of the time displayed in the ID area is set here. Trackball Sensitivity The sensitivity of the trackball is set here.

[Page 171] (2) Periperal System (System Preset) Freeze at VIDEO Play Used to set whether or not the VCR/DVD is paused by pressing Freeze during VCR/DVD playback. Freeze at VIDEO REC Used to set whether or not the VCR/DVD is paused by pressing Freeze during VCR/DVD recording. VIDEO Counter Used to set whether or not the VCR/DVD counter is displayed. Display VIDEO Maker Used to set the VCR/DVD manufacturer.

[Page 172] (3) OUTPUT (System Preset) Clip Store Format The dynamic image recording format (AVI or DICOM) can be selected here. Sono Printer (B/W) A B/W printer can be set here. The list includes the printers (servicing) recommended by Toshiba. Sono Printer (Color) A color printer can be set here. The list includes the printers (servicing) recommended by Toshiba. DICOM Printer A DICOM printer can be set here. The list includes the DICOM (servicing) printers set in the maintenance. The output is performed to the DICOM printer set here by operating the switches on the touch panel. DICOM Server The DICOM server can be set here. (servicing) The list includes the DICOM servers set in the maintenance. The output is performed to the DICOM server set here by operating the switches on the operating panel. Report Server The server for DICOM SR can be set. This item is displayed only (servicing) for the systems in which the DICOM option is installed. The parameters other than Clip Store Format are provided for use by service engineers only.

[Page 173] (4) Exam Information (System Preset) Operator Name Name of the operator. This is displayed on the Patient Information screen. The user can add items using the preset editor. Perform Physician Name of the physician who reads the ultrasound images. This is displayed on the Patient Information screen. The user can add items. Refer Physician Referring doctor (in the same hospital or satellite hospital). This is displayed on the Patient Information screen. The user can add items using the preset editor. Request Department Department requesting the examination. This is displayed on the Patient Information screen. The user can add items using the preset editor. Remove Used to delete items from the list using the preset editor. Emergency ID A special character can be set as the end character of the ID for (servicing) emergency patients. Unique character string : An arbitrary character can be set in the preset. Arbitrary character string : An arbitrary character can be set in the preset. Emergency Name A special character can be set as the end character of the name for (servicing) emergency patients. Unique character string : An arbitrary character can be set in the preset. Arbitrary character string : An arbitrary character can be set in the preset.

[Page 174] (5) Transducer M-TEE Pre-caution Message Used to set whether or not a warning Display message is displayed when the transducer surface temperature exceeds 42 ° C. Icon Display Used to set whether or not the icon is displayed. This parameter is displayed only when "Permission of Icon Display" is set to "Enable". Permission of Icon Display Used to set whether or not the user is (servicing) allowed to set the icon display. Mecha4D Treatment Used to set the post-operation treatment time of the transducer. This parameter is displayed only when the Mecha 4D unit is installed. Toshiba Mark Placement Used to select the Toshiba mark (T mark) (servicing) display position on the monitor.

[Page 175] (6) External Alpha-Protocol COM Port (servicing) Used to select the COM port for the Alpha protocol. Card Reader Search ID (servicing) Used to select whether or not to search the examination schedule acquired from the MWM for the data items that match the card reader information and to load them as patient information.

[Page 176] (7) Report Button Save to MO The [Save to MO] switch is displayed for "Xml (servicing) File Transfer" on the Report screen. CD The [Save to CD] switch is displayed for "Xml File Transfer" on the Report screen. Hide The [Save to CD] switch is not displayed. Button Send/Send [DICOM] Send The [Send] switch is displayed on the Report (servicing) screen. (Xml file format) Send [DICOM] The [Send] switch is displayed on the Report screen. (DICOM format) Hide The [Send] switch is not displayed. Destination Send [DICOM] MO The data is archived to an MO in the DICOM (servicing) format. Server The data is archived to a server in the DICOM format. CD-R The data is archived to a CD-R in the DICOM format.

[Page 177] (8) Other setting 2D 2D Mode Change Method Select the mode to be set when the 2D switch is set to ON. ANGLE COR Angle Correct Type Select the angle correction value (0 ° or 60 ° ). Quick Scan Auto Refresh on Unfreeze Select whether or not Auto Refresh is performed at the time of unfreezing. This parameter is effective only when the Quick Scan option is installed. Application Preset SH Display (servicing) Select whether or not SH is displayed. This parameter is effective only when the SH option is installed. Acoustic Power Gain Comp W/O CHI Select whether or not 2D Gain is automatically corrected when the acoustic power is changed. Security HIPPA (servicing) Select whether or not the license key input window is displayed at the time of startup.

[Page 178] (9) Exam Type ~ Application Preset Editor (a) Appl Meas. Number of Heart Cycles 1, 2, 3, 4, 5, 6, 7, 8 Specify the number of cardiac cycles in the for Heart Rate measurement range for the heart rate Measurement measurement. Erase in Cine Erase On Select whether the measurement marker is displayed or not during frame-advance or scroll playback. Background Color Black Gray Specify the background color (black or gray) of the measurement display window.

[Page 179] (b) Meas. Window Title Description Basic Measurement Vertical Line Specify whether or not vertical lines are to be displayed Window in the measurement display window. Transparent Mode Specify whether the background of the measurement display window is transparent or not. : Transparent : Not transparent Realtime Display Specify the display mode of the measurement display window. Current : All the acquired data is displayed in the measurement display window only after the measurement data is fixed. All : All the currently available data is displayed in the measurement display window.

[Page 180] Title Description Application Measurement Vertical Line Specify whether or not vertical lines are to be displayed *1 Window in the measurement display window . Transparent Mode Specify whether the background of the measurement display window is transparent or not. : Transparent : Not transparent Realtime Display Specify the display mode of the measurement display window. Current : All the acquired data is displayed in the measurement display window only after the *2 measurement data is fixed . All : All the currently available data is displayed in *3 the measurement display window . Font Type Specify the font size used in the measurement display *1 window. Value Size:14: The measurement item and unit are 13 pixels and the data is 14 pixels. Value Size:15: The measurement item and unit are 13 pixels and the data is 15 pixels. Bold: All the measurement items, units, and data are 13 pixels in bold. Highlight Specify whether or not the measurement result for the last measured item (the item for which the measurement mark is displayed in the window) is highlighted. (The ACT and TIC measurement displays are not highlighted.)* *1: This can be set for each Application Preset. *2: In vascular measurement, the system operates in "All" mode even when "Current" is selected. *3: For OB measurement, the system operates with the "Current" setting even when "All" is selected.

[Page 181] (c) 2D-Mode Meas. Select Tool to use for 3 Distances (fixed) ― Volume Measurements JOINT Baseline Right to Left The osseous acetabular angle ( α ) is displayed as viewed from the right with respect to the baseline, while the cartilaginous acetabular angle ( β ) is displayed as viewed from the left. Left to Right The osseous acetabular angle ( α ) is displayed as viewed from the left with respect to the baseline, while the cartilaginous acetabular angle ( β ) is displayed as viewed from the right.

[Page 182] (d) D-Mode Meas. <General (other than Adult Heart)>

[Page 183] *1 RI calc. method Ved RI is calculated using the Ved value. Vmin RI is calculated using the Vmin value. *2 PI calc. method Ved PI is calculated using the Ved value. Vmin PI is calculated using the Vmin value. Flow Volume Tool Range [Range] (Auto Trace) is set as the default when the Flow Volume or PI measurement is started. Auto Range [Auto Range] (Auto Range Trace) is set as the default when the Flow Volume or PI measurement is started. Vel Trace [Continuous Trace] (Freehand Trace) is set as the default when the Flow Volume or PI measurement is started. Flow Volume Calculation Vmean-peak The flow volume is calculated using the time- average value obtained by tracing the peak points (border) of the Doppler waveform. Vmean-mean The flow volume is calculated using the time- average value obtained by tracing the mean points (center of gravity) of the Doppler waveform. Vel Trace Tool Continuous [Continuous Trace] (Freehand Trace) is set as the default when the Vel Trace is started. Spline [Spline Trace] (Spline Trace) is set as the default when the Vel Trace measurement is started. Line [Line Trace] (LineTrace) is set as the default when the Vel Trace measurement is started. Range [Range Trace] (RangeTrace) is set as the default when the Vel Trace measurement is started. Auto Range [Auto Range] (Auto Range Trace) is set as the default when the Vel Trace measurement is started. *1: This setting is common to RI calculations in the velocity trace, RI trace, and flow volume measurements in the basic measurement mode. *2: This setting is common to PI calculations in the velocity trace, PI trace, and flow volume measurements in the basic measurement mode.

[Page 184] (e) D-Mode Meas. <When Adult Heart1, Adult Heart2, or Pediatric Heart is selected as an application preset>

[Page 185] *1 RI calc. method Ved RI is calculated using the Ved value. Vmin RI is calculated using the Vmin value. *2 PI calc. method Ved PI is calculated using the Ved value. Vmin PI is calculated using the Vmin value. Flow Volume Tool Range [Range] (Auto Trace) is set as the default when the Flow Volume, Vel Trace, or PI measurement is started. Auto Range Cannot be selected. Vel Trace [Continuous Trace] (Freehand Trace) is set as the default when the Flow Volume, Vel Trace, or PI measurement is started. Flow Volume Calculation Vmean-peak The flow volume is calculated using the time- average value obtained by tracing the peak points (border) of the Doppler waveform. Vmean-mean The flow volume is calculated using the time- average value obtained by tracing the mean points (center of gravity) of the Doppler waveform. Vel Trace Tool Continuous [Continuous Trace] (Freehand Trace) is set as the default when the Vel Trace measurement is started. Spline [Spline Trace] (Spline Trace) is set as the default when the Vel Trace measurement is started. Line [Line Trace] (LineTrace) is set as the default when the Vel Trace measurement is started. Range [Range Trace] (RangeTrace) is set as the default when the Vel Trace measurement is started. Auto Range Cannot be selected. *1: This setting is common to RI calculations in the velocity trace, RI trace, and flow volume measurements in the basic measurement mode. *2: This setting is common to PI calculations in the velocity trace, PI trace, and flow volume measurements in the basic measurement mode.

[Page 186] (f) Meas. Report Measurement Value Mean of The mean of the measurements is displayed as Display Method Measurements the result in the Report screen. Most Recent The most recent measurement is displayed as the Measurement result in the Report screen. Measurement Value Only Mean value is Only the mean of the measurements is displayed Display Default displayed* when the Report screen is started. All value is displayed All the measured values and their mean are displayed when the Report screen is started. Display OB Ratios in OB CI Specify whether the CI result is displayed or not Reports on the Report screen. FL/AC Specify whether the FL/AC result is displayed or not on the Report screen. FL/BPD Specify whether the FL/BPD result is displayed or not on the Report screen. FL/HC Specify whether the FL/HC result is displayed or not on the Report screen. HC/AC Specify whether the HC/AC result is displayed or not on the Report screen. Anatomy in OB Reports Type 1 The anatomy button is displayed on the Report screen in the Type1 format. Type 2 The anatomy button is displayed on the Report screen in the Type2 format. Hide The anatomy button is not displayed on the Report screen. Trend Format Single The trend graph is displayed in the Single format. Quad The trend graph is displayed in the Quad format. * When Carotid 1 or Carotid 2 is selected for Application Preset, "Measurement Value Display Default" is fixed to "Only Mean value is displayed".

[Page 187] (g) Meas. Report2 U/S GA On U/S GA is calculated. Off U/S GA is not calculated. GS Select the items to be used for calculating U/S GA. CRL BPD OFD HC HA AC FTA AA FL AXT

[Page 188] (h) Meas. Marker Marker Size [2D] Large, Middle, Small Specify the default size of the marker for 2D measurement. Auto-change Specify whether the marker is enlarged or not when the distance between the start point and end point exceeds a certain distance. Marker Style [2D] × , +, ∗ Specify the shape of the marker for 2D measurement. Marker Size [M] Large, Middle, Small Specify the default size of the marker for M-mode measurement. Marker Style [M] × , +, ∗ Specify the shape of the marker for M-mode measurement. Marker Size [Doppler] Large, Middle, Small Specify the default size of the marker for Doppler measurement. Marker Style [Doppler] × , +, ∗ Specify the shape of the marker for Doppler measurement. Time/HR Tool Connect line On, Off Specify whether or not the horizontal line display connecting the paired vertical lines in time measurement or HR measurement is to be displayed.

[Page 189] (i) Annotation Erase in Mode change Erase The annotation is erased when another image mode is selected. Not Erase The annotation is not erased when another image mode is selected. Inherit When image mode is changed from 2D to 2D+PW, the annotation is displayed at the default position on the 2D+PW image. Erase in Freeze off Erase Specify whether or not the annotation is erased when image freezing is released. : The annotation is erased. : The annotation is displayed. Cursor Type Arrow The arrow cursor is displayed when the annotation function is started. I Cursor The I-beam cursor is displayed when the annotation function is started.

[Page 190] (j) TIC Smoothing Off, 3, 5, 7, 9, 11, 13, 15 Specify the smoothing of the graph line. Off : Smoothing is not performed. 3 to 15 : Smoothing is performed based on the specified number of points.

[Page 191] (k) Body Mark BodyMark Size Regular Regular size Extended 1.5-times as large as the regular size Inherit Inherit ON Select this check box to cause the body mark to remain displayed when another image mode is selected. Erase in Freeze Off Erase Specify whether the body mark is erased or not when the image is unfrozen. : The body mark is erased. : The body mark is not erased.

[Page 192] (l) OB Calc. For the OB measurement items for which two or more authors are registered, the author to be used can be selected from a drop-down menu. Gestational Age : Specify the author of the formula to be used for calculating the gestational age. The specified author is also used as the default for generating the trend graph. Default Graph : Specify the item to be displayed as the default for trend graph creation. EFW : Specify the author of the formula to be used for calculating the estimated fetal weight. Extrapolated on : Check this to extend the EFW display range. Gestational Age GS Gestational sac diameter Hellman Rempen CRL Crown-rump length ASUM-V1 Nelson Rempen Robinson

[Page 193] Gestational Age BPD Biparietal diameter ASUM-V1 CFEF Chitty (0-0) Chitty (0-I) Kurtz Merz Nicolaides Rempen Sabbagh Shepard OFD Occipitofrontal diameter ASUM-V2 Chitty Merz Nicolaides HC Head circumference ASUM-V1 CFEF Chitty (pltd) Chitty (drvd) Merz HA Head area Chitty THD Thoracic diameter Hansmann AC Abdominal circumference ASUM-V1 CFEF Campbell Chitty (pltd) Chitty (drvd) Deter Merz Nicolaides Shepard APTD Anteroposterior trunk diameter Tokyo TTD Transverse trunk diameter Tokyo FTA Fetal trunk cross-sectional area Osaka AA Abdominal area Chitty APAD Anteroposterior abdominal Merz diameter

[Page 194] Gestational Age TAD Transverse abdominal diameter Merz CFEF FL Femur length ASUM-V1 CFEF Chitty Hohler Merz Nicolaides O'Brien Warda OOD Outer orbital diameter Jeanty Mayden Humerus Humerus ASUM-V2 Merz Clavicle Clavicle length Yarkoni Kidney Kidney length Bertagnoli Radius Radius Merz Ulna Ulna Jeanty Merz Tibia Tibia Jeanty Merz Fibula Fibula Merz CER Cerebellum Goldstein Hill Nicolaides Foot Foot length Mercer AXT APTD*TTD Tokyo

[Page 195] Gestational Age Default Measurement items of the default AA Graph graph AC APAD AXT BPD CER CRL Clavicle EFW FL FTA Fibula Foot GS HA HC HC (BPD, OFD) Humerus Kidney OFD Radius TAD THD Tibia Ulna EFW EFW Estimated fetal weight Campbell [AC] Hadlock1 [AC, FL] Hadlock2 [BPD, AC, FL] Hadlock3 [HC, AC, FL] Hadlock4 [BPD, HC, AC, FL] Hansman [BPD, THD] Merz1 [BPD, AC] Merz2 [AC] JSUM [BPD, AC, FL] Shepard [BPD, AC] Tokyo [BPD, APTD, TTD, FL] Osaka [BPD, FTA, FL]

[Page 196] (m) D-OB Calc. This menu is used to specify the default author data to be displayed on the trend graph for Doppler OB measurement. Trend Graph : Specify the author to be displayed as the default for trend graph creation. Default Graph : Specify the item to be displayed as the default for trend graph creation. Trend Graph Umb A RI Umbilical artery RI Mai Schaffer Umb A PI Umbilical artery PI Mai Harrington Schaffer MCA RI Middle cerebral artery RI Mai Schaffer MCA PI Middle cerebral artery PI Mai Harrington Schaffer

[Page 197] Trend Graph Fetal Ao RI Fetal aorta RI Mai Schaffer Fetal Ao PI Fetal aorta PI Mai Harrington Schaffer Lt Uterin RI Left uterine artery RI Schaffer Lt Uterin PI Left uterine artery PI Schaffer Rt Uterin RI Right uterine artery RI Schaffer Rt Uterin PI Right uterine artery PI Schaffer Default Graph Default Measurement items of the default Fetal Ao RI Graph graph Fetal Ao PI Lt Uterin RI Lt Uterin PI MCA RI MCA PI Rt Uterin RI Rt Uterin PI Umb A RI Umb A PI

[Page 198] (n) OB Meas. Method of OB weeks Mean of GA The mean of the GA measurement results is used to calculate LMP and EDD. Current GA The most recent GA measurement result is used to calculate LMP and EDD. U/S GA U/S GA is used to calculate LMP and EDD. Select Tool to use for OB Ellipse Select the tool for the area/circumference Circumference measurement (HC, HA, AC, FTA, AA, or TC Continuous Trace Measurements measurement). Cross Spline Trace Select Tool to use for OB Continuous Select the tool for the Vel Trace measurement Vel Trace Measurements (UmbA, MCA, Fetal Ao, Lt Uterin, or Rt Uterin Spline measurement). Line Range Auto Range RI calc. method for OB Ved The Ved value for the measured item is used for RI calculation. Vmin The Vmin value for the measured item is used for RI calculation. PI calc. method for OB Ved The Ved value for the measured item is used for PI calculation. Vmin The Vmin value for the measured item is used for PI calculation.

[Page 199] (o) OB Meas.2 Exam Type Exam Type OB Save Imaging Preset <Factory> Application Preset OB/Gyn1 Probe PVT-375BT Application Preset Editor OB Meas.2 Method of AFI 4 Distanace < 4 Distanace SD Display On Off GA Calculated by Only GA Chart FG Chart with Clinical Age Factory Setting Save Factory Setting Save Quit

[Page 200] Method for AFI 4 Distances AFI is displayed only after all the four distances are measured. < 4 Distances AFI is displayed even before all the four distances are measured. SD Display On/Off Specify whether or not the SD value is displayed in the OB measurement display window. GA Calculated by Only GA Chart If the data type is set to "GA" or "FG + GA", the GA value is calculated based on the GA data regardless of whether or not the clinical age is input. If the data type is set to "FG", the GA value is not calculated before the clinical age is input. Once the clinical age has been input, the GA value is calculated based on the FG data. If the data type is set to "Identical", the GA value is calculated based on the Identical data regardless of whether or not the clinical age is input. The trend graph is generated based on the FG data. FG Chart with Clinical Age If the data type is set to "FG", the GA value is not calculated before the clinical age is input. Once the clinical age has been input, the GA value is calculated based on the FG data. If the data type is set to "GA", the GA value is calculated based on the GA data before the clinical age is input. When the clinical age has been input, the GA value is not calculated. If the data type is set to "FG + GA", the GA value is calculated based on the GA data before the clinical age is input. Once the clinical age has been input, the GA value is calculated based on the FG data. If the data type is set to "Identical", the GA value is calculated based on the Identical data regardless of whether or not the clinical age is input. The trend graph is generated based on the FG data. The user can view the detailed contents of the two options for "GA Calculated by".

[Page 201] (p) LV (2D) used when 2D-mode LV measurement is started from the Cardiac measurement menu. Method Teichholz Select the LV measurement method to be Cube displayed in the application measurement (2D Gibson mode) menu. Single Plane Biplane Bullet Parallel Tool Type 3 sections Three segments (interventricular septal thickness, LV endocardial diameter, and LV posterior wall thickness) are measured in parallel. 4 sections Four segments (RV diameter, interventricular septal thickness, LV endocardial diameter, and LV posterior wall thickness) are measured in parallel. Parallel Tool Initial Angle -90 to 90 The default angle of the measurement marker for parallel measurement can be specified in 10° increments. MOD Simpson Tool Type Continuous The endocardium can be traced freehand for LV measurement (MOD Simpson method). Spline The endocardium can be traced using the spline trace method for LV measurement (MOD Simpson method).

[Page 202] (q) LV (M) used when M-mode LV measurement is started from the Cardiac measurement menu. Method Teichholz Specify the LV measurement method to be displayed in the application measurement (M Cube mode) menu. Gibson Next Sequence Type 1 NEXT Each time the switch is pressed in LV measurement, the item to be measured next is selected automatically in the range from the interventricular septum to the posterior wall both for end diastole and end systole. 2 NEXT When the switch is pressed in LV measurement, the endocardium only is selected as the item to be measured next for end systole. Parallel Tool Type 3 sections Three segments (interventricular septal thickness, LV endocardial diameter, and LV posterior wall thickness) are measured in parallel. 4 sections Four segments (RV diameter, interventricular septal thickness, LV endocardial diameter, and LV posterior wall thickness) are measured in parallel.

[Page 203] (r) Cardiac Doppler This menu is used to preset the measurement method etc, to be used when Doppler- mode measurement is started from the Cardiac measurement menu. E Vel Tool Vel The E wave of the LV inflow is measured using the velocity measurement method. DcT E-wave measurement on the E-wave waveform for LV inflow is performed together with DcT measurement. Output Data of DcT Specify whether PHT is to be measured together Tool with DcT. With PHT : PHT is measured together. : PHT is not measured together.

[Page 204] (s) LV Mass. used when LV Mass measurement is started from the Cardiac measurement menu. LV Mass Method LV Mass AL Specify the LV Mass measurement method to be displayed in the application measurement menu LV Mass TE (Extra). Mass Calc Method [2D] ASE-Cube Specify the LV Mass calculation method to be used in the LV measurement (2D mode). Penn-Cube AV-Cube Teichholz Not Display The LV Mass data is not displayed in the measurement display window or on the Report screen. Mass Calc Method [M] ASE-Cube Specify the LV Mass calculation method to be used in the LV measurement (M mode). Penn-Cube AV-Cube Teichholz Not Display The LV Mass data is not displayed in the measurement display window or on the Report screen.

[Page 205] (t) Carotid1 Meas. Tool *1 Area Ellipse The area is measured using the Ellipse method. Continuous Trace The area is measured using the Continuous Trace Spline Trace The area is measured using the Spline trace Cross The area is measured using the Cross method. *2 Velocity Trace Continuous The velocity is measured using the Continuous Trace method. Spline The velocity is measured using the Spline Trace Range The velocity is measured using the Auto Trace method with the range specified. Auto Range The velocity is measured using the Auto Trace method without specifying the range. *1: "Ellipse" is selected at the factory before shipment. *2: "Range" is selected at the factory before shipment.

[Page 206] (u) Carotid1 Doppler *1 Display type of Velocity Velocity The velocity (cm/s) is displayed as the measurement result. Frequency The frequency (kHz) is displayed as the measurement result. Display items of Velocity Vmax [Fmax] Specify the items to be displayed as the results of *2 Trace Velocity Trace measurement. Vmin [Fmin] The settings for Vmax [Fmax], Vmin [Fmin], Ved Ved [Fed] [Fed], and Vmean [Fmean] are fixed to . Vmean [Fmean] PI : The item is displayed. RI : The item is not displayed. S/D *3 RI calc. method Ved RI is calculated based on Ved. Vmin RI is calculated based on Vmin. *4 PI calc. method Ved PI is calculated based on Ved. Vmin PI is calculated based on Vmin. Combinations of CCA Prox Specify one of the CCA measurement regions for ICA/CCA calculating ICA/CCA. Mid Dist *5 ALL ICA Prox Specify any number of the ICA measurement regions for calculating ICA/CCA. Mid Dist

[Page 207] *1: [Velocity] is selected as the default. *2: All the items are set to (to be displayed) as the default. *3: [Ved] is selected as the default. *4: [Vmin] is selected as the default. *5: When "ALL" is selected, setting for ICA is not necessary. Combinations of "Prox-Prox", "Mid-Mid", and "Dist-Dist" are set automatically. (v) Carotid1 Meas. Type Doppler* Velocity Trace Tracing is performed in the Velocity Trace mode. PS Velocity The peak systolic velocity is measured in Velocity measurement mode. ED Velocity The end-diastolic velocity is measured in Velocity measurement mode. * "Velocity Trace" is selected as the default.

[Page 208] (w) Carotid2 Meas. Type *1 Right CV Doppler Velocity Trace The velocity is traced using the Velocity Trace PS Velocity The peak systolic velocity is measured using the Velocity measurement method. ED Velocity The end diastolic velocity is measured using the Velocity measurement method. *2 Right CV %Stenosis %Stenosis Area The stenosis ratio is calculated using the %Stenosis Area method. %Stenosis Distance The stenosis ratio is calculated using the %Stenosis Distance method. *3 Left CV Doppler Velocity Trace The velocity is traced using the Velocity Trace PS Velocity The peak systolic velocity is measured using the Velocity measurement method. ED Velocity The end diastolic velocity is measured using the Velocity measurement method. *4 Left CV %Stenosis %Stenosis Area The stenosis ratio is calculated using the %Stenosis Area method. %Stenosis Distance The stenosis ratio is calculated using the %Stenosis Distance method. *1: "Velocity Trace" is selected at the factory before shipment. *2: "%Stenosis Distance" is selected at the factory before shipment. *3: "Velocity Trace" is selected at the factory before shipment. *4: "%Stenosis Distance" is selected at the factory before shipment.

[Page 209] (x) Carotid2 Meas. Tool This menu is used to preset the default measurement method to be started when the Velocity Trace measurement switch is pressed in the Carotid2 menu of Vascular measurement mode. *1 Velocity Trace Continuous The area is measured using the Continuous Trace Spline The velocity is measured using the Spline Trace Range The velocity is measured using the Auto Trace method with the range specified. Auto Range The velocity is measured using the Auto Trace method without specifying the range. *1: "Range" is selected at the factory before shipment.

[Page 210] (y) Carotid2 Doppler *1 Display type of Velocity Velocity The velocity (cm/s) is displayed as the measurement result. Frequency The frequency (kHz) is displayed as the measurement result. Display items of Velocity Vmax [Fmax] Specify the items to be displayed as the results of *2 Trace Velocity Trace measurement. Vmin [Fmin] The settings for Vmax [Fmax], Vmin [Fmin], Ved Ved [Fed] [Fed], and Vmean [Fmean] are fixed to . Vmean [Fmean] PI : The item is displayed. RI : The item is not displayed. S/D *3 RI calc. method Ved RI is calculated based on Ved. Vmin RI is calculated based on Vmin. *4 PI calc. method Ved PI is calculated based on Ved. Vmin PI is calculated based on Vmin. *1: [Velocity] is selected as the default. *2: All the items are set to (to be displayed) as the default. *3: [Ved] is selected as the default. *4: [Vmin] is selected as the default.

[Page 211] (z) ACT measurement (option) If the optional ACT measurement program is installed, ACT measurement defaults can be preset. (Two pages are provided for ACT measurement.) • Page 1 Item Setting Function Contour Display Off Turns OFF the contour display. On Turns ON the contour display. Average Off Specifies the measurement and calculation methods for LV functions. The LV functions are measured and calculated using the data for only the cardiac cycle (between two successive end diastoles) containing the currently displayed frame. On Specifies the measurement and calculation methods for LV functions. The LV functions are measured and calculated by averaging the data for the specified number of cardiac cycles.

[Page 212] • Page 2 Item Setting Function Heart Beat [Beat] 1 to 5 Sets the number of cardiac cycles to be measured, starting from the measurement start frame. Graph Fitting Off Turns OFF graph fitting using the Fourier approximation. On Turns ON graph fitting using the Fourier approximation. The Order of Graph Fitting 1 to 50 Specifies the order of the Fourier approximation when "Graph fitting" is set to "On". RR Interval 0, 5, 10, 15, 20, 25, Sets the acceptable time difference between the R-R 30, 35, 40, 45, 50 intervals in the two-chamber and four-chamber Differential Time cross-sectional images in Biplane Volume Limit [%] measurement.

[Page 213] 12. BACKING UP THE USERS DATA 12.1 Backing Up the Preset Data 12.1.1 Backup The information in "D\aplio\user" must be backed up. The user-specified preset data can be backed up together with the system-specific information onto a removable media* using the User Maintenance and Service menu. * A CD-R drive is included in the standard system configuration. An MO drive is also included for use as a service tool. 12.1.2 Restoration The backed up information is restored to "D:\aplio\user". The backed up user-specified preset data is restored only when the system-specific information stored on the removable media matches that of the system to which the data is to be restored. If an attempt is made to restore information to a system other than the system where backup was performed, a warning dialog is displayed. Therefore, perform restoration carefully to the correct system. 12.2 Backing Up the Image Data 12.2.1 Backup The image data stored in the hard disk should be backed up onto a removable media using the Patient Browser. The data is saved in the DICOM format. For the operating procedures for Patient Browser, refer to the operation manual <<Applications>>. 12.2.2 Restoration Use the Patient Browser to restore the image data stored on a removable media to the hard disk. The data must be saved in the DICOM format. For the operating procedures for Patient Browser, refer to the operation manual <<Applications>>.

[Page 214] 13. NETWORK CONNECTION 13.1 Changing the PC Name If it is necessary to change the PC name for compatibility with the network environment, the database must be deleted and then created again. Follow the procedure below to back up the data, change the PC name, and restore the data. (1) Connect the network cable to the corresponding connector on the system and turn ON the power to start up the system. After the system starts up, use the copy function in Patient Browser to archive the patient information and image data in the HDD to a CD-R. (2) Display the service menu. Input the command "stopz.js" on Utilities Command Line and click Go to stop the system software. The service screen also disappears. (3) Select the [Start] button Æ Program Æ Accessory Æ Command prompt and then execute the "tus_rmdb.js" command to delete the database. After performing deletion, confirm that the database is deleted completely by following the procedures below. • Right-click the [Start] button and select Explorer from the menu. Confirm that no file or folder exist in the directories "D:\database" and "E:\Image". • If any file or folder exist in the directory "D:\database", select all with the Ctrl + A keys to delete them. Perform the same procedures for the directory "E:\Image".

[Page 215] (4) Set the network. Perform settings for the PC name and TCP/IP as indicated. For these settings to become effective, the system must be restarted. However, the system must not be restarted yet. When the PC name is changed, input "tus_chnm.js PC name" at the command prompt (3) above. (This work also can be performed by selecting Control panel Æ System Æ Advanced Æ Environment setting and by setting the PC name to VERSANT_DBID_NODE.) Terminate the command prompt. (5) Reboot the system by clicking the Start button and selecting Restart from the menu. (6) After restarting the system, execute the "tus_mkdb.js" command to create the database again. The display shown below is then displayed automatically. Confirm that the five databases are created. The display is an example with the PC name set as "toshiba1". <<Database list display example>> VERSANT Utility DBLIST Version 5.2.2.0.0 Copyright (c) 1989-1999 VERSANT Corporation ID = 1 DB name = ArchiveStore@toshiba1 creator = toshiba date created = Fri Jul 21 14:34:43 2006 db type = GROUP DATABASE db version = 5.2.2.0 ID = 2 DB name = Local@toshiba1 creator = toshiba date created = Fri Jul 21 14:35:21 2006 db type = GROUP DATABASE db version = 5.2.2.0 ID = 3 DB name = SchedulerStore@toshiba1 creator = toshiba date created = Fri Jul 21 14:36:09 2006 db type = GROUP DATABASE db version = 5.2.2.0 ID = 4 DB name = PimsExamArch@toshiba1 creator = toshiba date created = Fri Jul 21 14:36:31 2006 db type = GROUP DATABASE db version = 5.2.2.0 ID = 5 DB name = Exchangeboard@toshiba1 creator = toshiba date created = Fri Jul 21 14:37:11 2006 db type = PERSONAL DATABASE db version = 5.2.2.0

[Page 216] (7) Confirm that the network is connected. (8) Shut down the system by clicking the [Start] button and selecting Shutdown from the menu. (9) Restart the system. Start up the service menu and select [Configuration] Æ [DICOM] Æ [Local AEs]. On the local AEs page, click the [Save] button. (10) Select [Configuration] Æ [DICOM] Æ [network nodes] Æ [host]. On the host page, delete the PC name before change. Then, select the check box for "Set Local Host" and click the [Save] button. (11) Select [Configuration] Æ [DICOM] Æ [network nodes] Æ [remote]. If any of the parameter settings on the remote page, refer to the PC name before change, select the new PC name for the parameter, and click the [Save] button. (12) Execute "tus_ddgw_hostset.bat" from the command line. (13) Restart the system and restore the backed-up patient information and image data.

[Page 217] 14. DATE/TIME SETTING CHANGE To change the system date and time, use the procedure described below. 14.1 To Change the System Time Only (1) Press [Other] and then [Menu] on the touch panel. (2) Select [General Preset] from the System Setting pop-up menu. (3) In the "Time" field of the General Setting screen, change the setting of hour/minute/second. 14.2 To Change the System Date and Time (1) Activate the maintenance menu (for service engineers). For the activating procedures, refer to the service manual (2D730-513EN). (2) Select [Command Line] in "Utilities".

[Page 218] (3) Use the keyboard to enter "stopz.js" in the Command field and select [Go]. * Execution of this command takes approximately 2 minutes. Do not perform other key operations until execution of the command is completed. (4) The AplioXG software is terminated and a Windows screen appears. (5) Select [Start] → [Programs] → [Accessories] → [Windows Explorer] to open the Windows Explorer window.

[Page 219] (6) Select [My Computer] → [Control Panel] → [Date/Time] to open the Date/Time window. Change the date and time in this window. CAUTION: Never change the system date or time to differ from the factory setting by 24 hours or more. If the system date and time is changed from the factory setting by 24 hours or more, system performance cannot be assured and the HDD will have to be replaced. (7) Select [Start] → [Shutdown...] → [Shutdown] to shut down the system. (8) Start up the system again. 219 E